Tomoo Murakami

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,669,138
- Issue date Mar 11, 2014
- NEC Corporation
- Akinobu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,237,292
- Issue date Aug 7, 2012
- NEC Corporation
- Akinobu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having electronic components mounted therein and method for...
- Patent number 8,120,921
- Issue date Feb 21, 2012
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,902,678
- Issue date Mar 8, 2011
- NEC Corporation
- Akira Ohuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting flip chip on circuit board through reliable ele...
- Patent number 6,599,777
- Issue date Jul 29, 2003
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a semiconductor device to a substrate
- Patent number 6,449,838
- Issue date Sep 17, 2002
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting method and apparatus therefor
- Patent number 6,212,768
- Issue date Apr 10, 2001
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element mounting method
- Patent number 6,133,066
- Issue date Oct 17, 2000
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 6,069,024
- Issue date May 30, 2000
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring pattern board
- Patent number 5,968,589
- Issue date Oct 19, 1999
- NEC Corporation
- Tomoo Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting a semiconductor device to a substrate and a moun...
- Patent number 5,874,780
- Issue date Feb 23, 1999
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a printed circuit board having electrodes...
- Patent number 5,499,447
- Issue date Mar 19, 1996
- NEC Corporation
- Tomoo Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board with through-hole
- Patent number 5,499,446
- Issue date Mar 19, 1996
- NEC Corporation
- Tomoo Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of and apparatus for plating printed circuit board
- Patent number 5,480,675
- Issue date Jan 2, 1996
- NEC Corporation
- Tomoo Murakami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fabrication method of printed wiring board
- Patent number 5,464,662
- Issue date Nov 7, 1995
- NEC Corporation
- Tomoo Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130005085
- Publication date Jan 3, 2013
- NEC Corporation
- Akinobu SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100308474
- Publication date Dec 9, 2010
- Akinobu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING ELECTRONIC COMPONENTS MOUNTED THEREIN AND METHOD FOR...
- Publication number 20100188821
- Publication date Jul 29, 2010
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20080251942
- Publication date Oct 16, 2008
- Akira Ohuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for mounting flip chip on circuit board through reliable ele...
- Publication number 20020068382
- Publication date Jun 6, 2002
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting a semiconductor device to a substrate and a moun...
- Publication number 20020059722
- Publication date May 23, 2002
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING A SEMICONDUCTOR DEVICE TO A SUBSTRATE AND A MOUN...
- Publication number 20020005293
- Publication date Jan 17, 2002
- TOMOO MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting method and apparatus of bare chips
- Publication number 20010016372
- Publication date Aug 23, 2001
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and semiconductor device mounting method thereof
- Publication number 20010010393
- Publication date Aug 2, 2001
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS

Tomoo Murakami

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Device having electronic components mounted therein and method for...

Semiconductor device and manufacturing method thereof

Method for mounting flip chip on circuit board through reliable ele...

Method of mounting a semiconductor device to a substrate

Flip chip mounting method and apparatus therefor

Semiconductor element mounting method

Method for producing a semiconductor device

Method for manufacturing wiring pattern board

Method of mounting a semiconductor device to a substrate and a moun...

Method for manufacturing a printed circuit board having electrodes...

Method for manufacturing printed circuit board with through-hole

Method of and apparatus for plating printed circuit board

Fabrication method of printed wiring board

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

DEVICE HAVING ELECTRONIC COMPONENTS MOUNTED THEREIN AND METHOD FOR...

Semiconductor Device and Manufacturing Method Thereof

Method for mounting flip chip on circuit board through reliable ele...

Method of mounting a semiconductor device to a substrate and a moun...

METHOD OF MOUNTING A SEMICONDUCTOR DEVICE TO A SUBSTRATE AND A MOUN...

Mounting method and apparatus of bare chips

Semiconductor device and semiconductor device mounting method thereof