Tomoo Yamasaki

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect substrate and method of making the same
- Patent number 11,462,501
- Issue date Oct 4, 2022
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 9,780,032
- Issue date Oct 3, 2017
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, its manufacturing method, and semiconductor device
- Patent number 9,006,586
- Issue date Apr 14, 2015
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,878,077
- Issue date Nov 4, 2014
- Shinko Electric Industries Co., Ltd.
- Takashi Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,729,401
- Issue date May 20, 2014
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor containing a large number of filamentous conductors and m...
- Patent number 8,638,542
- Issue date Jan 28, 2014
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method thereof
- Patent number 8,288,659
- Issue date Oct 16, 2012
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having piercing linear conductors and semiconductor de...
- Patent number 8,242,612
- Issue date Aug 14, 2012
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,138,609
- Issue date Mar 20, 2012
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of wiring board
- Patent number 8,066,862
- Issue date Nov 29, 2011
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate to which semiconductor chi...
- Patent number 7,536,780
- Issue date May 26, 2009
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing capacitor device
- Patent number 7,531,011
- Issue date May 12, 2009
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor parts
- Patent number 7,403,370
- Issue date Jul 22, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring board
- Patent number 7,375,022
- Issue date May 20, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate for providing a capacitor structure ins...
- Patent number 7,352,060
- Issue date Apr 1, 2008
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor element, manufacturing method therefor, semiconductor dev...
- Patent number 7,341,919
- Issue date Mar 11, 2008
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring board
- Patent number 7,284,307
- Issue date Oct 23, 2007
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-film capacitor device, mounting module for the same, and metho...
- Patent number 7,282,419
- Issue date Oct 16, 2007
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and manufacturing method thereof, semiconductor device an...
- Patent number 7,223,652
- Issue date May 29, 2007
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, semiconductor device substrate, and manufactu...
- Patent number 7,161,242
- Issue date Jan 9, 2007
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor element, manufacturing method therefor, semiconductor dev...
- Patent number 7,115,931
- Issue date Oct 3, 2006
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate fabrication method and substrate
- Patent number 7,078,269
- Issue date Jul 18, 2006
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor device, electronic parts packaging structure, and method...
- Patent number 7,079,371
- Issue date Jul 18, 2006
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor device and method of manufacturing the same
- Patent number 7,072,168
- Issue date Jul 4, 2006
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor and method of producing same
- Patent number 7,038,904
- Issue date May 2, 2006
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor structure, a multi-layer wiring board including the same,...
- Patent number 6,999,299
- Issue date Feb 14, 2006
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-film capacitor device, mounting module for the same, and metho...
- Patent number 6,979,854
- Issue date Dec 27, 2005
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and manufacturing method thereof, semiconductor device an...
- Patent number 6,897,544
- Issue date May 24, 2005
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250079290
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20240413064
- Publication date Dec 12, 2024
- Shinko Electric Industries Co., Ltd.
- Takashi NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240334598
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20210125953
- Publication date Apr 29, 2021
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20170186684
- Publication date Jun 29, 2017
- Shinko Electric Industries Co., Ltd.
- TOMOO YAMASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
- Publication number 20120327626
- Publication date Dec 27, 2012
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120103667
- Publication date May 3, 2012
- Shinko Electric Industries Co., Ltd.
- Takashi ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110220404
- Publication date Sep 15, 2011
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20110061916
- Publication date Mar 17, 2011
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20110018144
- Publication date Jan 27, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110012266
- Publication date Jan 20, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110013340
- Publication date Jan 20, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090200072
- Publication date Aug 13, 2009
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Method of Wiring Board
- Publication number 20090188806
- Publication date Jul 30, 2009
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080239684
- Publication date Oct 2, 2008
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting substrate, manufacturing method of mounting substrate and...
- Publication number 20070119616
- Publication date May 31, 2007
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL STRUCTURE, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR...
- Publication number 20070040238
- Publication date Feb 22, 2007
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR PARTS
- Publication number 20060197184
- Publication date Sep 7, 2006
- Shinko Electric Industries Co., Ltd.
- Kiyoshi OI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing wiring board
- Publication number 20060141764
- Publication date Jun 29, 2006
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing wiring board
- Publication number 20060130303
- Publication date Jun 22, 2006
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing wiring substrate to which semiconductor chi...
- Publication number 20060131069
- Publication date Jun 22, 2006
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor device, electronic parts packaging structure, and method...
- Publication number 20060061936
- Publication date Mar 23, 2006
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor element, manufacturing method therefor, semiconductor dev...
- Publication number 20060008579
- Publication date Jan 12, 2006
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring substrate and method of manufacturing multilayer...
- Publication number 20050253248
- Publication date Nov 17, 2005
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin-film capacitor device, mounting module for the same, and metho...
- Publication number 20050181573
- Publication date Aug 18, 2005
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor device, electronic parts packaging structure, and method...
- Publication number 20050141169
- Publication date Jun 30, 2005
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor and manufacturing method thereof, semiconductor device an...
- Publication number 20050130368
- Publication date Jun 16, 2005
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor and method of producing same
- Publication number 20050088800
- Publication date Apr 28, 2005
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin-film capacitor and method of producing the capacitor
- Publication number 20050056939
- Publication date Mar 17, 2005
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor structure, a multi-layer wiring board including the same,...
- Publication number 20050052822
- Publication date Mar 10, 2005
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tomoo Yamasaki

Person

Patents Grantslast 30 patents

Interconnect substrate and method of making the same

Wiring substrate

Wiring substrate, its manufacturing method, and semiconductor device

Wiring substrate and method of manufacturing the same

Wiring substrate and method of manufacturing the same

Capacitor containing a large number of filamentous conductors and m...

Wiring board and manufacturing method thereof

Wiring board having piercing linear conductors and semiconductor de...

Semiconductor device and method of manufacturing semiconductor device

Manufacturing method of wiring board

Method of manufacturing wiring substrate to which semiconductor chi...

Method of manufacturing capacitor device

Capacitor parts

Method of manufacturing wiring board

Multilayer wiring substrate for providing a capacitor structure ins...

Capacitor element, manufacturing method therefor, semiconductor dev...

Method for manufacturing wiring board

Thin-film capacitor device, mounting module for the same, and metho...

Capacitor and manufacturing method thereof, semiconductor device an...

Semiconductor device, semiconductor device substrate, and manufactu...

Capacitor element, manufacturing method therefor, semiconductor dev...

Substrate fabrication method and substrate

Capacitor device, electronic parts packaging structure, and method...

Capacitor device and method of manufacturing the same

Capacitor and method of producing same

Capacitor structure, a multi-layer wiring board including the same,...

Thin-film capacitor device, mounting module for the same, and metho...

Capacitor and manufacturing method thereof, semiconductor device an...

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

WIRING BOARD

WIRING SUBSTRATE

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

WIRING SUBSTRATE

WIRING SUBSTRATE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND MANUFACTURING METHOD THEREOF

WIRING BOARD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CAPACITOR AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Manufacturing Method of Wiring Board

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Mounting substrate, manufacturing method of mounting substrate and...

COIL STRUCTURE, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR...

CAPACITOR PARTS

Method of manufacturing wiring board

Method for manufacturing wiring board

Method of manufacturing wiring substrate to which semiconductor chi...

Capacitor device, electronic parts packaging structure, and method...

Capacitor element, manufacturing method therefor, semiconductor dev...

Multilayer wiring substrate and method of manufacturing multilayer...

Thin-film capacitor device, mounting module for the same, and metho...

Capacitor device, electronic parts packaging structure, and method...

Capacitor and manufacturing method thereof, semiconductor device an...

Capacitor and method of producing same

Thin-film capacitor and method of producing the capacitor

Capacitor structure, a multi-layer wiring board including the same,...