Tomoshi Ohde

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 7,880,317
- Issue date Feb 1, 2011
- Sony Corporation
- Tomoshi Ohde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic component mounting structure, and electron...
- Patent number 7,436,682
- Issue date Oct 14, 2008
- Sony Computer Entertainment Inc.
- Yuji Nishitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making semiconductor device using a nickel film for stop...
- Patent number 6,838,368
- Issue date Jan 4, 2005
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a semiconductor device
- Patent number 6,514,847
- Issue date Feb 4, 2003
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method of manufacture
- Patent number 6,368,943
- Issue date Apr 9, 2002
- Sony Corporation
- Tomoshi Ohde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,326,676
- Issue date Dec 4, 2001
- Sony Corporation
- Tomoshi Ohde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,020,626
- Issue date Feb 1, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090302450
- Publication date Dec 10, 2009
- SONY CORPORATION
- Tomoshi Ohde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080185712
- Publication date Aug 7, 2008
- SONY CORPORATION
- Fujio Kanayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacturing the Same
- Publication number 20070290310
- Publication date Dec 20, 2007
- SONY CORPORATION
- Hidetoshi KUSANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board, electronic component mounting structure, and electron...
- Publication number 20070119618
- Publication date May 31, 2007
- Yuji Nishitani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD MAKING THE SAME, AND ELECTRONIC DEVICE...
- Publication number 20010005050
- Publication date Jun 28, 2001
- KENJI OHSAWA
- H01 - BASIC ELECTRIC ELEMENTS