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Tomotaka Tabuchi

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210057225
    • Publication date Feb 25, 2021
    • Disco Corporation
    • Hideyuki SANDOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    GRINDING APPARATUS AND USE METHOD OF GRINDING APPARATUS
    • Publication number 20200391337
    • Publication date Dec 17, 2020
    • Disco Corporation
    • Tomotaka TABUCHI
    • B24 - GRINDING POLISHING
  • Information Patent Application

    WORKPIECE PROCESSING METHOD
    • Publication number 20180330957
    • Publication date Nov 15, 2018
    • Disco Corporation
    • Frank Wei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE CHIP MANUFACTURING METHOD
    • Publication number 20180308755
    • Publication date Oct 25, 2018
    • Disco Corporation
    • Tomotaka Tabuchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20180166282
    • Publication date Jun 14, 2018
    • Disco Corporation
    • Tomotaka Tabuchi
    • B24 - GRINDING POLISHING
  • Information Patent Application

    WAFER DIVIDING METHOD
    • Publication number 20170140989
    • Publication date May 18, 2017
    • Disco Corporation
    • Tomotaka Tabuchi
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Application

    PROCESSING METHOD FOR WORKPIECE
    • Publication number 20160042962
    • Publication date Feb 11, 2016
    • Disco Corporation
    • Yoshiteru Nishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160042996
    • Publication date Feb 11, 2016
    • Disco Corporation
    • Susumu Yakoo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20150147870
    • Publication date May 28, 2015
    • Disco Corporation
    • Kazuma Sekiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20150140784
    • Publication date May 21, 2015
    • Disco Corporation
    • Kazuma Sekiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Production method for semiconductor chip
    • Publication number 20040048419
    • Publication date Mar 11, 2004
    • Masahiko Kitamura
    • H01 - BASIC ELECTRIC ELEMENTS