Tomotake Morita

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Yamagata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer lapping method capable of achieving a stable abrasion rate
- Patent number 6,102,778
- Issue date Aug 15, 2000
- NEC Corporation
- Tomotake Morita
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 5,961,794
- Issue date Oct 5, 1999
- NEC Corporation
- Tomotake Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus having retainer ring rounded along outer periph...
- Patent number 5,944,590
- Issue date Aug 31, 1999
- NEC Corporation
- Akira Isobe
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Wafer holder protecting wafer against electrostatic breakdown
- Publication number 20030045218
- Publication date Mar 6, 2003
- NEC Corporation
- Masayoshi Kasahara
- B24 - GRINDING POLISHING