Tomoya DAIZO

Person

Ogaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing wiring substrate
- Patent number 12,033,927
- Issue date Jul 9, 2024
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate having metal post offset from conductor pad and me...
- Patent number 11,935,822
- Issue date Mar 19, 2024
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,622,446
- Issue date Apr 4, 2023
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined substrate
- Patent number 9,401,320
- Issue date Jul 26, 2016
- Ibiden Co., Ltd.
- Tomoya Daizo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20220015234
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220013409
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220013455
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220013448
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE
- Publication number 20210257224
- Publication date Aug 19, 2021
- IBIDEN CO., LTD.
- Kazuhiko KURANOBU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED SUBSTRATE
- Publication number 20150255433
- Publication date Sep 10, 2015
- IBIDEN CO., LTD.
- Tomoya DAIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150156880
- Publication date Jun 4, 2015
- IBIDEN CO., LTD.
- Tomoya DAIZO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Tomoya DAIZO

Person

Patents Grantslast 30 patents

Method for manufacturing wiring substrate

Wiring substrate having metal post offset from conductor pad and me...

Wiring substrate

Combined substrate

Patents Applicationslast 30 patents

WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE

COMBINED SUBSTRATE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD