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Tomoya Egawa
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Himeji-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Adhesive conductive paste
Patent number
12,152,169
Issue date
Nov 26, 2024
Daicel Corporation
Takanori Kobatake
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Curable composition for sealing optical semiconductor
Patent number
9,685,597
Issue date
Jun 20, 2017
Daicel Corporation
Masanori Marukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Addition-curable metallosiloxane compound
Patent number
8,791,221
Issue date
Jul 29, 2014
Daicel Corporation
Tomoya Egawa
C07 - ORGANIC CHEMISTRY
Patents Applications
last 30 patents
Information
Patent Application
ADHESIVE CONDUCTIVE PASTE
Publication number
20220275247
Publication date
Sep 1, 2022
DAICEL CORPORATION
Takanori KOBATAKE
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
RESIN COMPOSITION FOR FORMING HARD COATING LAYER
Publication number
20200347180
Publication date
Nov 5, 2020
DAICEL CORPORATION
Tomoya EGAWA
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
RESIN COMPOSITION FOR FORMING HARD COATING LAYER
Publication number
20200199372
Publication date
Jun 25, 2020
DAICEL CORPORATION
Tomoya Egawa
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
Publication number
20160126431
Publication date
May 5, 2016
DAICEL CORPORATION
Masanori MARUKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADDITION-CURABLE METALLOSILOXANE COMPOUND
Publication number
20130267653
Publication date
Oct 10, 2013
DAICEL CORPORATION
Tomoya Egawa
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...