Tomoya Egawa

Person

  • Himeji-shi, JP

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ADHESIVE CONDUCTIVE PASTE

    • Publication number 20220275247
    • Publication date Sep 1, 2022
    • DAICEL CORPORATION
    • Takanori KOBATAKE
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    RESIN COMPOSITION FOR FORMING HARD COATING LAYER

    • Publication number 20200347180
    • Publication date Nov 5, 2020
    • DAICEL CORPORATION
    • Tomoya EGAWA
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    RESIN COMPOSITION FOR FORMING HARD COATING LAYER

    • Publication number 20200199372
    • Publication date Jun 25, 2020
    • DAICEL CORPORATION
    • Tomoya Egawa
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR

    • Publication number 20160126431
    • Publication date May 5, 2016
    • DAICEL CORPORATION
    • Masanori MARUKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ADDITION-CURABLE METALLOSILOXANE COMPOUND

    • Publication number 20130267653
    • Publication date Oct 10, 2013
    • DAICEL CORPORATION
    • Tomoya Egawa
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...