Tomoya TERAKURA

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Ogaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed wiring board with conductive post...
- Patent number 9,713,267
- Issue date Jul 18, 2017
- Ibiden Co., Ltd.
- Toru Furuta
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 9,332,657
- Issue date May 3, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH CONDUCTIVE POST...
- Publication number 20150282314
- Publication date Oct 1, 2015
- IBIDEN CO., LTD.
- Toru FURUTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20130081870
- Publication date Apr 4, 2013
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR