Tomoya TSUKUI

Follow

Person

Shibukawa-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat-resistant adhesive sheet for semiconductor testing
- Patent number 9,963,622
- Issue date May 8, 2018
- DENKA COMPANY LIMITED
- Gosuke Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet and method of manufacturing electronic component
- Patent number 9,934,997
- Issue date Apr 3, 2018
- DENKA COMPANY LIMITED
- Tomoya Tsukui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACK GRINDING ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICOND...
- Publication number 20220148905
- Publication date May 12, 2022
- DISCO CORPORATION
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Application
ADHESIVE SHEET FOR BACKGRINDING AND PRODUCTION METHOD FOR SEMICONDU...
- Publication number 20220135848
- Publication date May 5, 2022
- DISCO CORPORATION
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20170200629
- Publication date Jul 13, 2017
- DENKA COMPANY LIMITED
- Tomoya TSUKUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-RESISTANT ADHESIVE SHEET FOR SEMICONDUCTOR TESTING
- Publication number 20160130481
- Publication date May 12, 2016
- DENKA COMPANY LIMITED
- Gosuke NAKAJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...