Tomoya YAMAZAWA

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Niigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Liquid sealing material for copper bump, and resin composition for...
- Patent number 10,941,280
- Issue date Mar 9, 2021
- Namics Corporation
- Tomoya Yamazawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, semiconductor sealing agent, and semicondu...
- Patent number 10,196,513
- Issue date Feb 5, 2019
- Namics Corporation
- Tomoya Yamazawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, semiconductor sealing agent, and semicondu...
- Patent number 9,947,604
- Issue date Apr 17, 2018
- Namics Corporation
- Kazuyuki Kohara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD OF PRODUC...
- Publication number 20240132714
- Publication date Apr 25, 2024
- NAMICS CORPORATION
- Yuki MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID SEALING MATERIAL FOR COPPER BUMP, AND RESIN COMPOSITION FOR...
- Publication number 20170335090
- Publication date Nov 23, 2017
- Tomoya YAMAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDU...
- Publication number 20170022356
- Publication date Jan 26, 2017
- NAMICS CORPORATION
- Tomoya YAMAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDU...
- Publication number 20170005021
- Publication date Jan 5, 2017
- Namics Corporation
- Kazuyuki KOHARA
- H01 - BASIC ELECTRIC ELEMENTS