Tomoyasu Murakami

Person

Suita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dry etching method, fine structure formation method, mold and mold...
- Patent number 7,919,005
- Issue date Apr 5, 2011
- Panasonic Corporation
- Hideo Nakagawa
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Dry etching method, fine structure formation method, mold and mold...
- Patent number 7,906,030
- Issue date Mar 15, 2011
- Panasonic Corporation
- Hideo Nakagawa
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Dry etching method, fine structure formation method, mold and mold...
- Patent number 7,758,761
- Issue date Jul 20, 2010
- Panasonic Corporation
- Hideo Nakagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry etching method, fine structure formation method, mold and mold...
- Patent number 7,731,862
- Issue date Jun 8, 2010
- Panasonic Corporation
- Hideo Nakagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate holder, method for polishing substrate, and method for fa...
- Patent number 6,251,000
- Issue date Jun 26, 2001
- Matsushita Electric Industrial Co., Ltd.
- Tomoyasu Murakami
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad for semiconductor wafer and method for polishing semi...
- Patent number 6,099,390
- Issue date Aug 8, 2000
- Matsushita Electronics Corporation
- Mikio Nishio
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for holding substrate to be polished
- Patent number 6,074,289
- Issue date Jun 13, 2000
- Matsushita Electric Industrial Co., Ltd.
- Tomoyasu Murakami
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 6,012,967
- Issue date Jan 11, 2000
- Matsushita Electric Industrial Co., Ltd.
- Mitsunari Satake
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for polishing semiconductor substrate
- Patent number 5,866,480
- Issue date Feb 2, 1999
- Matsushita Electric Industrial Co., Ltd.
- Tomoyasu Murakami
- B24 - GRINDING POLISHING
Information Patent Grant
Method of preventing diffusion between interconnect and plug
- Patent number 5,834,369
- Issue date Nov 10, 1998
- Matsushita Electric Industrial Co., Ltd.
- Tomoyasu Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin layer forming method wherein hydrophobic molecular layers prev...
- Patent number 5,576,247
- Issue date Nov 19, 1996
- Matsushita Electric Industrial Co., Ltd.
- Kousaku Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method
- Patent number 5,569,628
- Issue date Oct 29, 1996
- Matsushita Electric Industrial Co., Ltd.
- Kousaku Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a multi-layer metallic wiring structure
- Patent number 5,385,867
- Issue date Jan 31, 1995
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preventing the corrosion of metallic wirings
- Patent number 5,312,776
- Issue date May 17, 1994
- Matsushita Electric Industrial Co., Ltd.
- Tomoyasu Murakami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUS
- Publication number 20180345397
- Publication date Dec 6, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- KOICHI NAGAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dry etching method, fine structure formation method, mold and mold...
- Publication number 20090017259
- Publication date Jan 15, 2009
- Hideo Nakagawa
- G02 - OPTICS
Information Patent Application
Dry etching method, fine structure formation method, mold and mold...
- Publication number 20090011065
- Publication date Jan 8, 2009
- Hideo Nakagawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Dry etching method, fine structure formation method, mold and mold...
- Publication number 20070187359
- Publication date Aug 16, 2007
- Hideo Nakagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dry etching method, fine structure formation method, mold and mold...
- Publication number 20070187362
- Publication date Aug 16, 2007
- Hideo Nakagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tomoyasu Murakami

Person

Patents Grantslast 30 patents

Dry etching method, fine structure formation method, mold and mold...

Dry etching method, fine structure formation method, mold and mold...

Dry etching method, fine structure formation method, mold and mold...

Dry etching method, fine structure formation method, mold and mold...

Substrate holder, method for polishing substrate, and method for fa...

Polishing pad for semiconductor wafer and method for polishing semi...

Apparatus for holding substrate to be polished

Polishing method and polishing apparatus

Method and apparatus for polishing semiconductor substrate

Method of preventing diffusion between interconnect and plug

Thin layer forming method wherein hydrophobic molecular layers prev...

Semiconductor device fabrication method

Method for forming a multi-layer metallic wiring structure

Method of preventing the corrosion of metallic wirings

Patents Applicationslast 30 patents

VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUS

Dry etching method, fine structure formation method, mold and mold...

Dry etching method, fine structure formation method, mold and mold...

Dry etching method, fine structure formation method, mold and mold...

Dry etching method, fine structure formation method, mold and mold...