Tomoyuki HAKATA

Person

Uji-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Crimp structure, crimping method, and electronic device
- Patent number 10,632,517
- Issue date Apr 28, 2020
- Omron Corporation
- Eiji Teramoto
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Manufacturing method of bonding structure and bonding structure
- Patent number 10,471,660
- Issue date Nov 12, 2019
- Omron Corporation
- Kazuyoshi Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structure and method for producing bonded structure
- Patent number 10,449,698
- Issue date Oct 22, 2019
- Omron Corporation
- Kazuyoshi Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crimp structure, crimping method, and electronic device
- Patent number 9,793,637
- Issue date Oct 17, 2017
- Omron Corporation
- Eiji Teramoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT-DISSIPATING STRUCTURE
- Publication number 20240040749
- Publication date Feb 1, 2024
- Omron Corporation
- Junya MISHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD OF BONDED STRUCTURE AND BONDED STRUCTURE
- Publication number 20180207847
- Publication date Jul 26, 2018
- Omron Corporation
- Kazuyoshi NISHIKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
TRANSFORMER
- Publication number 20170352470
- Publication date Dec 7, 2017
- OMRON AUTOMOTIVE ELECTRONICS CO., LTD.
- Masahiro Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND METHOD FOR PRODUCING BONDED STRUCTURE
- Publication number 20170259468
- Publication date Sep 14, 2017
- Omron Corporation
- Kazuyoshi NISHIKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD OF BONDING STRUCTURE AND BONDING STRUCTURE
- Publication number 20170210058
- Publication date Jul 27, 2017
- Omron Corporation
- Kazuyoshi NISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CRIMP STRUCTURE, CRIMPING METHOD, AND ELECTRONIC DEVICE
- Publication number 20170120321
- Publication date May 4, 2017
- Omron Corporation
- Eiji TERAMOTO
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
CRIMP STRUCTURE, CRIMPING METHOD, AND ELECTRONIC DEVICE
- Publication number 20170098905
- Publication date Apr 6, 2017
- Omron Corporation
- Eiji TERAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINED STRUCTURE AND METHOD FOR MANUFACTURING JOINED STRUCTURE
- Publication number 20160052202
- Publication date Feb 25, 2016
- Omron Corporation
- Kazuyoshi Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Tomoyuki HAKATA

Person

Patents Grantslast 30 patents

Crimp structure, crimping method, and electronic device

Manufacturing method of bonding structure and bonding structure

Bonded structure and method for producing bonded structure

Crimp structure, crimping method, and electronic device

Patents Applicationslast 30 patents

HEAT-DISSIPATING STRUCTURE

PRODUCTION METHOD OF BONDED STRUCTURE AND BONDED STRUCTURE

TRANSFORMER

BONDED STRUCTURE AND METHOD FOR PRODUCING BONDED STRUCTURE

MANUFACTURING METHOD OF BONDING STRUCTURE AND BONDING STRUCTURE

CRIMP STRUCTURE, CRIMPING METHOD, AND ELECTRONIC DEVICE

CRIMP STRUCTURE, CRIMPING METHOD, AND ELECTRONIC DEVICE

JOINED STRUCTURE AND METHOD FOR MANUFACTURING JOINED STRUCTURE