Tomoyuki Kanai

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Chuo-ku, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive sheet for backgrinding and production method for semicondu...
- Patent number 12,312,512
- Issue date May 27, 2025
- Disco Corporation
- Karl Heinz Priewasser
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Back grinding adhesive sheet, and method for manufacturing semicond...
- Patent number 12,243,766
- Issue date Mar 4, 2025
- Disco Corporation
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
COPOLYMER, SURFACTANT, RESIN COMPOSITION, AND HEAT DISSIPATION SHEET
- Publication number 20250002630
- Publication date Jan 2, 2025
- DENKA COMPANY LIMITED
- Kosuke WADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COPOLYMER, DISPERSANT, AND RESIN COMPOSITION
- Publication number 20220186089
- Publication date Jun 16, 2022
- Denka Company Limited
- Ippei TAKASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACK GRINDING ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICOND...
- Publication number 20220148905
- Publication date May 12, 2022
- DISCO CORPORATION
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Application
ADHESIVE SHEET FOR BACKGRINDING AND PRODUCTION METHOD FOR SEMICONDU...
- Publication number 20220135848
- Publication date May 5, 2022
- DISCO CORPORATION
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS