Tomoyuki Morita

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a patterned tungsten damascene interconnect
- Patent number 6,780,764
- Issue date Aug 24, 2004
- Oki Electric Industry Co., Ltd.
- Tomoyuki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,706,645
- Issue date Mar 16, 2004
- Oki Electric Industry Co., Ltd.
- Tomoyuki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,458,716
- Issue date Oct 1, 2002
- Oki Electric Industry Co., Ltd.
- Tomoyuki Morita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of forming a patterned tungsten damascene interconnect
- Publication number 20030119303
- Publication date Jun 26, 2003
- Tomoyuki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20020192951
- Publication date Dec 19, 2002
- Tomoyuki Morita
- H01 - BASIC ELECTRIC ELEMENTS