Tomoyuki Ohmura

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Packaging method using lead-free solder
- Patent number 7,131,566
- Issue date Nov 7, 2006
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wave soldering method using lead-free solder, apparatus therefor, a...
- Patent number 7,048,173
- Issue date May 23, 2006
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging method using lead-free solder
- Patent number 6,585,149
- Issue date Jul 1, 2003
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Packaging method using lead-free solder
- Publication number 20030201310
- Publication date Oct 30, 2003
- Hitachi, Ltd
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wave soldering method using lead-free solder, apparatus therefor, a...
- Publication number 20030116352
- Publication date Jun 26, 2003
- Hitachi, Ltd
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging method using lead-free solder
- Publication number 20030034381
- Publication date Feb 20, 2003
- Tetsuya Nakatsuka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...