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TOMOYUKI SHIMODAIRA

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  • NAGANO-SHI, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Interconnect substrate having groove around pad
    • Patent number 12,191,255
    • Issue date Jan 7, 2025
    • Shinko Electric Industries Co., Ltd.
    • Hikaru Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate and manufacturing method thereof
    • Patent number 11,574,866
    • Issue date Feb 7, 2023
    • Shinko Electric Industries Co., Ltd.
    • Yoshihisa Kanbe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate and manufacturing method thereof
    • Patent number 11,211,326
    • Issue date Dec 28, 2021
    • Shinko Electric Industries Co., Ltd.
    • Yoshihisa Kanbe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of manufacturing wiring board
    • Patent number 11,001,930
    • Issue date May 11, 2021
    • SHINKO ELECTRIC INDUSTRIES CO, LTD.
    • Tomoyuki Shimodaira
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Wiring substrate and electronic component device
    • Patent number 10,643,934
    • Issue date May 5, 2020
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki Shimodaira
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate
    • Patent number 9,918,378
    • Issue date Mar 13, 2018
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki Shimodaira
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Terminal structure and wiring substrate
    • Patent number 9,893,002
    • Issue date Feb 13, 2018
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki Shimodaira
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring board and electronic component device
    • Patent number 9,711,476
    • Issue date Jul 18, 2017
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki Shimodaira
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring board
    • Patent number 9,699,912
    • Issue date Jul 4, 2017
    • Shinko Electric Industries Co., Ltd.
    • Toyoaki Sakai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board and method of manufacturing the same
    • Patent number 9,232,641
    • Issue date Jan 5, 2016
    • Shinko Electric Industries Co., Ltd.
    • Takahiro Rokugawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate and method of manufacturing the same
    • Patent number 8,669,478
    • Issue date Mar 11, 2014
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi Kondo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate
    • Patent number 8,450,852
    • Issue date May 28, 2013
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi Kondo
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD AND SEMICONDUCTOR DEVICE
    • Publication number 20250113438
    • Publication date Apr 3, 2025
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki SHIMODAIRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
    • Publication number 20230120515
    • Publication date Apr 20, 2023
    • Shinko Electric Industries Co., Ltd.
    • Hikaru TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20230123522
    • Publication date Apr 20, 2023
    • Shinko Electric Industries Co., Ltd.
    • Hikaru TANAKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
    • Publication number 20230089948
    • Publication date Mar 23, 2023
    • Shinko Electric Industries Co., Ltd.
    • Takashi Kasuga
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
    • Publication number 20220068808
    • Publication date Mar 3, 2022
    • Shinko Electric Industries Co., Ltd.
    • Yoshihisa Kanbe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
    • Publication number 20200411432
    • Publication date Dec 31, 2020
    • Shinko Electric Industries Co., Ltd.
    • Yoshihisa Kanbe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING WIRING BOARD
    • Publication number 20200413545
    • Publication date Dec 31, 2020
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki SHIMODAIRA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE
    • Publication number 20190221508
    • Publication date Jul 18, 2019
    • Shinko Electric Industries Co., Ltd.
    • TOMOYUKI SHIMODAIRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TERMINAL STRUCTURE AND WIRING SUBSTRATE
    • Publication number 20170179012
    • Publication date Jun 22, 2017
    • Shinko Electric Industries Co., Ltd.
    • TOMOYUKI SHIMODAIRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
    • Publication number 20160365327
    • Publication date Dec 15, 2016
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki Shimodaira
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20160316560
    • Publication date Oct 27, 2016
    • Shinko Electric Industries Co., Ltd.
    • Toyoaki SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20130313010
    • Publication date Nov 28, 2013
    • Shinko Electric Industries Co., Ltd.
    • Takahiro Rokugawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20110316148
    • Publication date Dec 29, 2011
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi KONDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20110308849
    • Publication date Dec 22, 2011
    • SHINKO ELECTRIC INDUSTRIES CO. LTD.
    • Hitoshi KONDO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
    • Publication number 20110297425
    • Publication date Dec 8, 2011
    • Shinko Electric Industries Co., Ltd.
    • Junichi Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20110290536
    • Publication date Dec 1, 2011
    • Shinko Electric Industries Co., Ltd.
    • Kentaro Kaneko
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20090288870
    • Publication date Nov 26, 2009
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi KONDO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR