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Tomoyuki Suwa

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  • Miyagi, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SELECTIVE FILM FORMATION METHOD
    • Publication number 20230175115
    • Publication date Jun 8, 2023
    • TOKYO ELECTRON LIMITED
    • Shuji AZUMO
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD OF FORMING NITRIDE FILM
    • Publication number 20190390332
    • Publication date Dec 26, 2019
    • TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    • Shinichi NISHIMURA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    FILM FORMING APPARATUS AND FILM FORMING METHOD
    • Publication number 20190074177
    • Publication date Mar 7, 2019
    • TOKYO ELECTRON LIMITED
    • Akira SHIMIZU
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Surface Treatment Method for Atomically Flattening a Silicon Wafer...
    • Publication number 20160276171
    • Publication date Sep 22, 2016
    • NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY
    • Tadahiro OHMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140252436
    • Publication date Sep 11, 2014
    • TOHOKU UNIVERSITY
    • Tomoyuki Suwa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SURFACE TREATMENT METHOD FOR ATOMICALLY FLATTENING A SILICON WAFER...
    • Publication number 20120292743
    • Publication date Nov 22, 2012
    • Tadahiro OHMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE
    • Publication number 20100213516
    • Publication date Aug 26, 2010
    • National University Corporation Tohoku University
    • Tadahiro Ohmi
    • H01 - BASIC ELECTRIC ELEMENTS