Tomoyuki YAMADA

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Wappingers Falls, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer circuit using metal layers as a moisture diffusion barr...
- Patent number 10,813,215
- Issue date Oct 20, 2020
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit using metal layers as a moisture diffusion barr...
- Patent number 10,806,030
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit using metal layers as a moisture diffusion barr...
- Patent number 10,687,420
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Jean Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...
- Publication number 20160211481
- Publication date Jul 21, 2016
- Kyocera Circuit Solutions Inc.
- Jean AUDET
- G01 - MEASURING TESTING
Information Patent Application
MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...
- Publication number 20160211229
- Publication date Jul 21, 2016
- Kyocera Circuit Solutions Inc.
- Jean AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...
- Publication number 20160210398
- Publication date Jul 21, 2016
- Kyocera Circuit Solutions Inc.
- Jean AUDET
- G06 - COMPUTING CALCULATING COUNTING