Tong An

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Beijing, CN

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for measuring fretting displacement in power cycl...
- Patent number 11,698,248
- Issue date Jul 11, 2023
- Beijing University of Technology
- Tong An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure balancing clamp for press-pack insulated gate bipolar tran...
- Patent number 11,699,633
- Issue date Jul 11, 2023
- Beijing University of Technology
- Tong An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for on-line measurement of wafer grinding force
- Patent number 11,404,329
- Issue date Aug 2, 2022
- Beijing University of Technology
- Fei Qin
- B24 - GRINDING POLISHING
Information Patent Grant
Packaging structure of a SiC MOSFET power module and manufacturing...
- Patent number 11,251,106
- Issue date Feb 15, 2022
- Beijing University of Technology
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package in package (PiP) electronic device and manufacturing method...
- Patent number 9,397,068
- Issue date Jul 19, 2016
- Beijing University of Technology
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FCOC (Flip Chip On Chip) package and manufacturing method thereof
- Patent number 8,951,840
- Issue date Feb 10, 2015
- Beijing University of Technology
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE BALANCING CLAMP FOR PRESS-PACK INSULATED GATE BIPOLAR TRAN...
- Publication number 20230245946
- Publication date Aug 3, 2023
- BEIJING UNIVERSITY OF TECHNOLOGY
- Tong AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device And Method For On-line Measurement Of Wafer Grinding Force
- Publication number 20210407863
- Publication date Dec 30, 2021
- BEIJING UNIVERSITY OF TECHNOLOGY
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure of a SiC MOSFET power module and manufacturing...
- Publication number 20210217681
- Publication date Jul 15, 2021
- BEIJING UNIVERSITY OF TECHNOLOGY
- FEI QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package in Package (PiP) Electronic Device and Manufacturing Method...
- Publication number 20150348934
- Publication date Dec 3, 2015
- BEIJING UNIVERSITY OF TECHNOLOGY
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FCoC (Flip Chip on Chip) Package and Manufacturing Method thereof
- Publication number 20140302640
- Publication date Oct 9, 2014
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS