Tong Chen

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Asymmetrical slow wave structures to eliminate backward wave oscill...
- Patent number 9,202,660
- Issue date Dec 1, 2015
- Teledyne Wireless, LLC
- Yehuda G. Goren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-substrate layer semiconductor packages and method for making...
- Patent number 6,933,603
- Issue date Aug 23, 2005
- Teledyne Technologies Incorporated
- Tong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a device with a lead frame, and an apparatus fo...
- Patent number 6,828,663
- Issue date Dec 7, 2004
- Teledyne Technologies Incorporated
- Tong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for linearizing vacuum electronic amplification
- Patent number 6,590,450
- Issue date Jul 8, 2003
- Teledyne Technologies Incorporated
- Tong Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microwave device and method for making same
- Patent number 6,507,110
- Issue date Jan 14, 2003
- Teledyne Technologies Incorporated
- Tong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for linearizing vacuum electronic amplification
- Patent number 6,498,532
- Issue date Dec 24, 2002
- Teledyne Technologies Incorporated
- Yehuda G. Goren
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
System and method for linearizing vacuum electronic amplification
- Patent number 6,285,254
- Issue date Sep 4, 2001
- Teledyne Technologies Incorporated
- Tong Chen
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Asymmetrical Slow Wave Structures to Eliminate Backward Wave Oscill...
- Publication number 20140265826
- Publication date Sep 18, 2014
- Yehuda G. Goren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a package
- Publication number 20050023663
- Publication date Feb 3, 2005
- Tong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-substrate layer semiconductor packages and method for making...
- Publication number 20040007776
- Publication date Jan 15, 2004
- Tong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging a device with a lead frame, and an apparatus fo...
- Publication number 20020125553
- Publication date Sep 12, 2002
- Tong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for linearizing vacuum electronic amplification
- Publication number 20020093379
- Publication date Jul 18, 2002
- Yehuda G. Goren
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
System and method for linearizing vacuum electronic amplification
- Publication number 20020041211
- Publication date Apr 11, 2002
- Tong Chen
- H03 - BASIC ELECTRONIC CIRCUITRY

Person

Patents Grantslast 30 patents

Asymmetrical slow wave structures to eliminate backward wave oscill...

Multi-substrate layer semiconductor packages and method for making...

Method of packaging a device with a lead frame, and an apparatus fo...

System and method for linearizing vacuum electronic amplification

Microwave device and method for making same

System and method for linearizing vacuum electronic amplification

System and method for linearizing vacuum electronic amplification

Patents Applicationslast 30 patents

Asymmetrical Slow Wave Structures to Eliminate Backward Wave Oscill...

Method of forming a package

Multi-substrate layer semiconductor packages and method for making...

Method of packaging a device with a lead frame, and an apparatus fo...

System and method for linearizing vacuum electronic amplification

System and method for linearizing vacuum electronic amplification