Tong Qing CHEN

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor local interconnect and contact
- Patent number 8,304,834
- Issue date Nov 6, 2012
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Pradeep Ramachandramurthy Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnects
- Patent number 8,102,054
- Issue date Jan 24, 2012
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Bei Chao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnects
- Patent number 7,803,704
- Issue date Sep 28, 2010
- Chartered Semiconductor Manufacturing, Ltd.
- Bei Chao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
- Patent number 7,524,755
- Issue date Apr 28, 2009
- Chartered Semiconductor Manufacturing, Ltd.
- Johnny Widodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electrical interconnect structures using polymer...
- Patent number 7,488,687
- Issue date Feb 10, 2009
- Samsung Electronics Co., Ltd.
- Wan Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor local interconnect and contact
- Patent number 7,119,005
- Issue date Oct 10, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Pradeep Ramachandramurthy Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor local interconnect and contact
- Patent number 6,884,712
- Issue date Apr 26, 2005
- Chartered Semiconductor Manufacturing, Ltd.
- Pradeep Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RELIABLE INTERCONNECTS
- Publication number 20100314774
- Publication date Dec 16, 2010
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Bei Chao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECTS
- Publication number 20100044869
- Publication date Feb 25, 2010
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Bei Chao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Interconnections of Microelectronic Device Us...
- Publication number 20080070409
- Publication date Mar 20, 2008
- Wan-jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Electrical Interconnect Structures Using Polymer...
- Publication number 20080064199
- Publication date Mar 13, 2008
- Wan Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
- Publication number 20070197023
- Publication date Aug 23, 2007
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Johnny Widodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LOCAL INTERCONNECT AND CONTACT
- Publication number 20060281253
- Publication date Dec 14, 2006
- Chartered Semiconductor Manufacturing LTD.
- Pradeep Ramachandramurthy Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor local interconnect and contact
- Publication number 20050130402
- Publication date Jun 16, 2005
- Yelehanka Ramachandramurthy Pradeep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor local interconnect and contact
- Publication number 20040155269
- Publication date Aug 12, 2004
- Chartered Semiconductor Mfg. Ltd.
- Pradeep Ramachandramurthy Yelehanka
- H01 - BASIC ELECTRIC ELEMENTS

Tong Qing CHEN

Person

Patents Grantslast 30 patents

Semiconductor local interconnect and contact

Reliable interconnects

Reliable interconnects

Entire encapsulation of Cu interconnects using self-aligned CuSiN film

Methods of forming electrical interconnect structures using polymer...

Semiconductor local interconnect and contact

Method of manufacturing semiconductor local interconnect and contact

Patents Applicationslast 30 patents

RELIABLE INTERCONNECTS

RELIABLE INTERCONNECTS

Method of Fabricating Interconnections of Microelectronic Device Us...

Methods of Forming Electrical Interconnect Structures Using Polymer...

Entire encapsulation of Cu interconnects using self-aligned CuSiN film

SEMICONDUCTOR LOCAL INTERCONNECT AND CONTACT

Semiconductor local interconnect and contact

Method of manufacturing semiconductor local interconnect and contact