Tong-Suk KIM

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Package-on-package (PoP) semiconductor package and electronic syste...
- Patent number 12,033,991
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Tong-suk Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Package-on-package (PoP) semiconductor package and electronic syste...
- Patent number 11,552,062
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Tong-suk Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Package-on-package (PoP) semiconductor package and electronic syste...
- Patent number 10,971,484
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Tong-suk Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Package-on-package (PoP) semiconductor package and electronic syste...
- Patent number 10,692,846
- Issue date Jun 23, 2020
- Samsung Electronics Co., Ltd.
- Tong-suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multi pitch ball land
- Patent number 8,817,486
- Issue date Aug 26, 2014
- Samsung Electronics Co., Ltd.
- Tong-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multi pitch ball land
- Patent number 8,400,779
- Issue date Mar 19, 2013
- Samsung Electronics Co., Ltd.
- Tong-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...
- Publication number 20240321842
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Tong-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...
- Publication number 20230129617
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Tong-suk KIM
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...
- Publication number 20210242186
- Publication date Aug 5, 2021
- Samsung Electronics Co., Ltd.
- Tong-suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...
- Publication number 20200294979
- Publication date Sep 17, 2020
- Samsung Electronics Co., Ltd.
- Tong-suk KIM
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...
- Publication number 20190139946
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Tong-suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTI PITCH BALL LAND
- Publication number 20130154103
- Publication date Jun 20, 2013
- Samsung Electronics Co., Ltd.
- Tong-Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS E...
- Publication number 20120068350
- Publication date Mar 22, 2012
- Samsung Electronics Co., Ltd.
- Tong-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTI PITCH BALL LAND
- Publication number 20110116247
- Publication date May 19, 2011
- Samsung Electronics Co., Ltd.
- Tong-Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS

Tong-Suk KIM

Person

Patents Grantslast 30 patents

Package-on-package (PoP) semiconductor package and electronic syste...

Package-on-package (PoP) semiconductor package and electronic syste...

Package-on-package (PoP) semiconductor package and electronic syste...

Package-on-package (PoP) semiconductor package and electronic syste...

Semiconductor package having multi pitch ball land

Semiconductor package having multi pitch ball land

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...

PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...

PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...

PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...

PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...

SEMICONDUCTOR PACKAGE HAVING MULTI PITCH BALL LAND

SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS E...

SEMICONDUCTOR PACKAGE HAVING MULTI PITCH BALL LAND