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Tong Wa Chao
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Reconfigurable thermal control of high-powered integrated circuitry
Patent number
10,973,154
Issue date
Apr 6, 2021
Intel Corporation
Tong W. Chao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconfigurable cooling assembly for integrated circuitry
Patent number
10,930,575
Issue date
Feb 23, 2021
Intel Corporation
Prabhakar Subrahmanyam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package having bottom-side stiffener
Patent number
8,952,511
Issue date
Feb 10, 2015
Intel Corporation
Ajit V. Sathe
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat spreader for a multi-chip package
Patent number
7,944,046
Issue date
May 17, 2011
Intel Corporation
Tong Wa Chao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES
Publication number
20230420338
Publication date
Dec 28, 2023
Intel Corporation
Prabhakar SUBRAHMANYAM
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHODS AND APPARATUS FOR AN AUTONOMOUS STAGE-SWITCHING MULTI-STAGE...
Publication number
20230025369
Publication date
Jan 26, 2023
Prabhakar Subrahmanyam
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS
Publication number
20220225542
Publication date
Jul 14, 2022
Intel Corporation
Prabhakar SUBRAHMANYAM
G11 - INFORMATION STORAGE
Information
Patent Application
RECONFIGURABLE THERMAL CONTROL OF HIGH-POWERED INTEGRATED CIRCUITRY
Publication number
20200229325
Publication date
Jul 16, 2020
Intel Corporation
Tong W. CHAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RECONFIGURABLE COOLING ASSEMBLY FOR INTEGRATED CIRCUITRY
Publication number
20200027808
Publication date
Jan 23, 2020
Intel Corporation
Prabhakar SUBRAHMANYAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat Spreader for a multi-chip package
Publication number
20090219698
Publication date
Sep 3, 2009
Tong Wa Chao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING BOTTOM-SIDE STIFFENER
Publication number
20090152738
Publication date
Jun 18, 2009
Ajit V. Sathe
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Heat spreader for a multi-chip package
Publication number
20080128897
Publication date
Jun 5, 2008
Tong Wa Chao
H01 - BASIC ELECTRIC ELEMENTS