Tong Yan Tee

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Piezo-resistive force sensor with bumps on membrane structure
- Patent number 8,800,391
- Issue date Aug 12, 2014
- STMicroelectronics Asia Pacific Pte, Ltd.
- Xueren Zhang
- G01 - MEASURING TESTING
Information Patent Grant
Ultra-thin quad flat no-lead (QFN) package
- Patent number 8,642,396
- Issue date Feb 4, 2014
- STMicroelectronics, Inc.
- Kim-yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube-modified low-K materials
- Patent number 8,592,980
- Issue date Nov 26, 2013
- STMicroelectronics Asia Pacific Pte., Ltd.
- Shanzhong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for improving solder joint reliability in an inte...
- Patent number 8,524,531
- Issue date Sep 3, 2013
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhancing metal/low-K interconnect reliability using a protection l...
- Patent number 8,486,824
- Issue date Jul 16, 2013
- STMicroelectronics Asia Pacific Pte., Ltd.
- Tong Yan Tee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System and method for improving solder joint reliability in an inte...
- Patent number 8,330,258
- Issue date Dec 11, 2012
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhancing metal/low-K interconnect reliability using a protection l...
- Patent number 8,217,518
- Issue date Jul 10, 2012
- STMicroelectronics Asia Pacific Pte., Ltd.
- Tong Yan Tee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ultra-thin quad flat no-lead (QFN) package
- Patent number 8,018,036
- Issue date Sep 13, 2011
- STMicroelectronics Asia Pacific PTE Ltd.
- Kim-yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interposer for reducing warping of integrated circuit packag...
- Patent number 7,196,425
- Issue date Mar 27, 2007
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR IMPROVING SOLDER JOINT RELIABILITY IN AN INTE...
- Publication number 20130130492
- Publication date May 23, 2013
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCING METAL/LOW-K INTERCONNECT RELIABILITY USING A PROTECTION L...
- Publication number 20130012016
- Publication date Jan 10, 2013
- STMicroelectronics Asia Pacific Pte. Ltd.
- Tong Yan Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN QUAD FLAT NO-LEAD (QFN) PACKAGE
- Publication number 20120028397
- Publication date Feb 2, 2012
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kim-yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Piezo-resistive force sensor with bumps on membrane structure
- Publication number 20080178691
- Publication date Jul 31, 2008
- STMicroelectronics Asia Pacific Pte. Ltd.
- Xueren Zhang
- G01 - MEASURING TESTING
Information Patent Application
Enhancing metal/low-K interconnect reliability using a protection l...
- Publication number 20070216032
- Publication date Sep 20, 2007
- STMicroelectronics Asia Pacific Pte. Ltd.
- Tong Yan Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon nanotube-modified low-K materials
- Publication number 20070210455
- Publication date Sep 13, 2007
- STMicroelectronics Asia Pacific Pte. Ltd.
- Shanzhong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-thin quad flat no-lead (QFN) package
- Publication number 20070114641
- Publication date May 24, 2007
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kim-yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interposer for reducing warping of integrated circuit packag...
- Publication number 20060071345
- Publication date Apr 6, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for improving solder joint reliability in an inte...
- Publication number 20050139972
- Publication date Jun 30, 2005
- STMicroelectronics, Inc.
- Anthony M. Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Tong Yan Tee

Person

Patents Grantslast 30 patents

Piezo-resistive force sensor with bumps on membrane structure

Ultra-thin quad flat no-lead (QFN) package

Carbon nanotube-modified low-K materials

System and method for improving solder joint reliability in an inte...

Enhancing metal/low-K interconnect reliability using a protection l...

System and method for improving solder joint reliability in an inte...

Enhancing metal/low-K interconnect reliability using a protection l...

Ultra-thin quad flat no-lead (QFN) package

Copper interposer for reducing warping of integrated circuit packag...

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR IMPROVING SOLDER JOINT RELIABILITY IN AN INTE...

ENHANCING METAL/LOW-K INTERCONNECT RELIABILITY USING A PROTECTION L...

ULTRA-THIN QUAD FLAT NO-LEAD (QFN) PACKAGE

Piezo-resistive force sensor with bumps on membrane structure

Enhancing metal/low-K interconnect reliability using a protection l...

Carbon nanotube-modified low-K materials

Ultra-thin quad flat no-lead (QFN) package

Copper interposer for reducing warping of integrated circuit packag...

System and method for improving solder joint reliability in an inte...