Tony Dambrauskas

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Underfill flow management in electronic assemblies
- Patent number 11,935,861
- Issue date Mar 19, 2024
- Intel Coropration
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,824,991
- Issue date Nov 21, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,583,390
- Issue date Feb 28, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,257,276
- Issue date Feb 9, 2016
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step etch for metal bump formation
- Patent number 7,427,565
- Issue date Sep 23, 2008
- Intel Corporation
- Tony Dambrauskas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a coaxial trace in a surrounding material,...
- Patent number 7,402,501
- Issue date Jul 22, 2008
- Intel Corporation
- Tony Dambrauskas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for anchoring a seal ring to a substrate using vias and ass...
- Patent number 7,354,799
- Issue date Apr 8, 2008
- Intel Corporation
- Daniel J. Kinderknecht
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A MOLD MATERIAL WITH A STRESS-...
- Publication number 20240421102
- Publication date Dec 19, 2024
- Intel Corporation
- Chunqing Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPR...
- Publication number 20240213074
- Publication date Jun 27, 2024
- Intel Corporation
- Mark SALTAS
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES
- Publication number 20210343677
- Publication date Nov 4, 2021
- Intel Corporation
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20170141061
- Publication date May 18, 2017
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20160307869
- Publication date Oct 20, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20160155667
- Publication date Jun 2, 2016
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20140138818
- Publication date May 22, 2014
- Alexsandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a coaxial trace in a surrounding material,...
- Publication number 20080251896
- Publication date Oct 16, 2008
- Tony Dambrauskas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECESSED SOLDER SOCKET IN A SEMICONDUCTOR SUBSTRATE
- Publication number 20080237881
- Publication date Oct 2, 2008
- Tony DAMBRAUSKAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a coaxial trace in a surrounding material,...
- Publication number 20070257338
- Publication date Nov 8, 2007
- Tony Dambrauskas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for anchoring a seal ring to a substrate using vias and ass...
- Publication number 20070105370
- Publication date May 10, 2007
- Daniel J. Kinderknecht
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multi-step etch for metal bump formation
- Publication number 20070004190
- Publication date Jan 4, 2007
- Tony Dambrauskas
- H01 - BASIC ELECTRIC ELEMENTS

Tony Dambrauskas

Person

Patents Grantslast 30 patents

Underfill flow management in electronic assemblies

Laser die backside film removal for integrated circuit (IC) packaging

Organic thin film passivation of metal interconnections

Organic thin film passivation of metal interconnections

Laser die backside film removal for integrated circuit (IC) packaging

Organic thin film passivation of metal interconnections

Multi-step etch for metal bump formation

Method of manufacturing a coaxial trace in a surrounding material,...

Methods for anchoring a seal ring to a substrate using vias and ass...

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES INCLUDING A MOLD MATERIAL WITH A STRESS-...

ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPR...

UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

Method of manufacturing a coaxial trace in a surrounding material,...

RECESSED SOLDER SOCKET IN A SEMICONDUCTOR SUBSTRATE

Method of manufacturing a coaxial trace in a surrounding material,...

Methods for anchoring a seal ring to a substrate using vias and ass...

Multi-step etch for metal bump formation