Tony K. Lim

Person

Naperville, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microphone assembly with standoffs for die bonding
- Patent number 11,750,983
- Issue date Sep 5, 2023
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Insert molded or over molded insulating layers on enclosures for mi...
- Patent number 11,696,082
- Issue date Jul 4, 2023
- Knowles Electronics, LLC
- Norman Dennis Talag
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sensor package with ingress protection
- Patent number 11,662,236
- Issue date May 30, 2023
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package
- Patent number 10,924,867
- Issue date Feb 16, 2021
- Knowles Electroics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) device packaging
- Patent number 10,640,371
- Issue date May 5, 2020
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package
- Patent number 10,631,099
- Issue date Apr 21, 2020
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package with ingress protection
- Patent number 10,591,326
- Issue date Mar 17, 2020
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package for fully encapsulated ASIC and wires
- Patent number 10,547,955
- Issue date Jan 28, 2020
- Knowles Electronics, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sensor device with ingress protection
- Patent number 10,291,973
- Issue date May 14, 2019
- Knowles Electronics, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectromechanical system (MEMS) device packaging
- Patent number 10,227,232
- Issue date Mar 12, 2019
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone with coined area
- Patent number 9,883,270
- Issue date Jan 30, 2018
- Knowles Electronics, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Housing and method to control solder creep on housing
- Patent number 9,402,118
- Issue date Jul 26, 2016
- Knowles Electronics, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MICROPHONE ASSEMBLY WITH STANDOFFS FOR DIE BONDING
- Publication number 20210392442
- Publication date Dec 16, 2021
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INSERT MOLDED OR OVER MOLDED INSULATING LAYERS ON ENCLOSURES FOR MI...
- Publication number 20210037330
- Publication date Feb 4, 2021
- KNOWLES ELECTRONICS, LLC
- Norman Dennis Talag
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE PACKAGE
- Publication number 20200245078
- Publication date Jul 30, 2020
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE WITH INGRESS PROTECTION
- Publication number 20200209024
- Publication date Jul 2, 2020
- KNOWLES ELECTRONICS, LLC
- Tony K. LIM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGING
- Publication number 20190169022
- Publication date Jun 6, 2019
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE WITH INGRESS PROTECTION
- Publication number 20190145806
- Publication date May 16, 2019
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE PACKAGE
- Publication number 20190014421
- Publication date Jan 10, 2019
- Knowles Electronics, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE PACKAGE FOR FULLY ENCAPSULATED ASIC AND WIRES
- Publication number 20180343524
- Publication date Nov 29, 2018
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SENSOR DEVICE WITH INGRESS PROTECTION
- Publication number 20180070162
- Publication date Mar 8, 2018
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGING
- Publication number 20180029880
- Publication date Feb 1, 2018
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE WITH COINED AREA
- Publication number 20160337735
- Publication date Nov 17, 2016
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method and Apparatus for an Acoustic Device Having a Coating
- Publication number 20150172825
- Publication date Jun 18, 2015
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COVER FOR A MEMS MICROPHONE
- Publication number 20140291783
- Publication date Oct 2, 2014
- KNOWLES ELECTRONICS, LLC
- Dennis Talag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microphone Assembly
- Publication number 20140037120
- Publication date Feb 6, 2014
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Housing And Method To Control Solder Creep On Housing
- Publication number 20140037124
- Publication date Feb 6, 2014
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Tony K. Lim

Person

Patents Grantslast 30 patents

Microphone assembly with standoffs for die bonding

Insert molded or over molded insulating layers on enclosures for mi...

Sensor package with ingress protection

Microphone package

Microelectromechanical system (MEMS) device packaging

Microphone package

Sensor package with ingress protection

Microphone package for fully encapsulated ASIC and wires

Sensor device with ingress protection

Microelectromechanical system (MEMS) device packaging

Microphone with coined area

Housing and method to control solder creep on housing

Patents Applicationslast 30 patents

MICROPHONE ASSEMBLY WITH STANDOFFS FOR DIE BONDING

INSERT MOLDED OR OVER MOLDED INSULATING LAYERS ON ENCLOSURES FOR MI...

MICROPHONE PACKAGE

SENSOR PACKAGE WITH INGRESS PROTECTION

MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGING

SENSOR PACKAGE WITH INGRESS PROTECTION

MICROPHONE PACKAGE

MICROPHONE PACKAGE FOR FULLY ENCAPSULATED ASIC AND WIRES

SENSOR DEVICE WITH INGRESS PROTECTION

MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE PACKAGING

MICROPHONE WITH COINED AREA

Method and Apparatus for an Acoustic Device Having a Coating

COVER FOR A MEMS MICROPHONE

Microphone Assembly

Housing And Method To Control Solder Creep On Housing