Tony V. Mule

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Hillsboro, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer etch stop layers for advanced integrated circuit struct...
- Patent number 12,119,344
- Issue date Oct 15, 2024
- Intel Corporation
- Anthony V. Mule'
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect cladding
- Patent number 11,270,943
- Issue date Mar 8, 2022
- Intel Corporation
- Flavio Griggio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask for low-k interlayer dielectric patterning
- Patent number 7,649,264
- Issue date Jan 19, 2010
- Intel Corporation
- Tony V. Mule
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER INTERCONNECT CLADDING
- Publication number 20220157735
- Publication date May 19, 2022
- Intel Corporation
- Flavio Griggio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER ETCH STOP LAYERS FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20220102343
- Publication date Mar 31, 2022
- Intel Corporation
- Anthony V. MULE'
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT CLADDING
- Publication number 20190304918
- Publication date Oct 3, 2019
- Intel Corporation
- Flavio Griggio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hard mask for low-k interlayer dielectric patterning
- Publication number 20080079155
- Publication date Apr 3, 2008
- Tony V. Mule
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping layer to reduce amine poisoning of photoresist layers
- Publication number 20070059913
- Publication date Mar 15, 2007
- Sean W. King
- H01 - BASIC ELECTRIC ELEMENTS