Toong Erh Ooi

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Patents Grantslast 30 patents

Information Patent Grant
Embedded die-down package-on-package device
- Patent number 9,812,422
- Issue date Nov 7, 2017
- Intel Corporation
- Toong Erh Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die-down package-on-package device
- Patent number 9,455,218
- Issue date Sep 27, 2016
- Intel Corporation
- Toong Erh Ooi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE
- Publication number 20170012020
- Publication date Jan 12, 2017
- Intel Corporation
- Toong Erh Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE
- Publication number 20140291866
- Publication date Oct 2, 2014
- Toong Erh Ooi
- H01 - BASIC ELECTRIC ELEMENTS