Tooru Kikuchi

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon-containing alicyclic polyimide resin, polyamic acid resin,...
- Patent number 8,592,546
- Issue date Nov 26, 2013
- Hitachi Chemical Company, Ltd.
- Tooru Kikuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid tetracarboxylic dianhydrides and process for the preparation...
- Patent number 8,524,921
- Issue date Sep 3, 2013
- Hitachi Chemical Co., Ltd.
- Tooru Kikuchi
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,781,896
- Issue date Aug 24, 2010
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,387,914
- Issue date Jun 17, 2008
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,078,094
- Issue date Jul 18, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,057,265
- Issue date Jun 6, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,012,320
- Issue date Mar 14, 2006
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 6,855,579
- Issue date Feb 15, 2005
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating method of film-shaped organic die-bonding material, die-...
- Patent number 6,825,249
- Issue date Nov 30, 2004
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 6,717,242
- Issue date Apr 6, 2004
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating method of film-shaped organic die-bonding material, die-...
- Patent number 6,099,678
- Issue date Aug 8, 2000
- Hitachi Chemical Company Ltd.
- Akio Kotato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID R...
- Publication number 20130158225
- Publication date Jun 20, 2013
- Tooru Kikuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPA...
- Publication number 20110301362
- Publication date Dec 8, 2011
- Hitachi Chemical Company, Ltd.
- Tooru Kikuchi
- C07 - ORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF
- Publication number 20080290529
- Publication date Nov 27, 2008
- HITACHI CHEMICAL CO., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin Paste For Die Bonding And Its Use
- Publication number 20070290369
- Publication date Dec 20, 2007
- HITACHI CHEMICAL CO., LTD.
- Yuji Hasegawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin Paste for Die Bonding
- Publication number 20070225438
- Publication date Sep 27, 2007
- Yuji Hasegawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF
- Publication number 20060180903
- Publication date Aug 17, 2006
- HITACHI CHEMICAL CO., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20040253770
- Publication date Dec 16, 2004
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20030160337
- Publication date Aug 28, 2003
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010035533
- Publication date Nov 1, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010016384
- Publication date Aug 23, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS

Tooru Kikuchi

Person

Patents Grantslast 30 patents

Silicon-containing alicyclic polyimide resin, polyamic acid resin,...

Liquid tetracarboxylic dianhydrides and process for the preparation...

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Laminating method of film-shaped organic die-bonding material, die-...

Semiconductor device and process for fabrication thereof

Laminating method of film-shaped organic die-bonding material, die-...

Patents Applicationslast 30 patents

NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID R...

NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPA...

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

Resin Paste For Die Bonding And Its Use

Resin Paste for Die Bonding

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof