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Tooru Mochida

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  • Higashiyamato, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,619,530
    • Issue date Sep 16, 2003
    • Kabushiki Kaisha Shinkawa
    • Hiroshi Ushiki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,595,400
    • Issue date Jul 22, 2003
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,502,738
    • Issue date Jan 7, 2003
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 6,467,678
    • Issue date Oct 22, 2002
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,343,733
    • Issue date Feb 5, 2002
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,250,539
    • Issue date Jun 26, 2001
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire loop shape for a semiconductor device
    • Patent number 6,222,274
    • Issue date Apr 24, 2001
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,213,384
    • Issue date Apr 10, 2001
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,080,651
    • Issue date Jun 27, 2000
    • Kabushiki Kaisha Shinkawa
    • Kuniyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lead frame supplying method and apparatus
    • Patent number 6,045,318
    • Issue date Apr 4, 2000
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lead frame supplying apparatus
    • Patent number 6,033,932
    • Issue date Mar 7, 2000
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lead frame supplying method
    • Patent number 6,001,670
    • Issue date Dec 14, 1999
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and wire bonding method therefor
    • Patent number 5,989,995
    • Issue date Nov 23, 1999
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,967,401
    • Issue date Oct 19, 1999
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,961,029
    • Issue date Oct 5, 1999
    • Kabushiki Kaisha Shinkawa
    • Shinichi Nishiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,524,811
    • Issue date Jun 11, 1996
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Motor control circuit for a wire bonding apparatus
    • Patent number 5,485,063
    • Issue date Jan 16, 1996
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,386,936
    • Issue date Feb 7, 1995
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrasonic wire bonding method
    • Patent number 5,364,009
    • Issue date Nov 15, 1994
    • Kabushiki Kaisha Shinkawa
    • Kuniyuki Takahashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding point polarity determining apparatus
    • Patent number 5,287,064
    • Issue date Feb 15, 1994
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 5,219,112
    • Issue date Jun 15, 1993
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 5,207,370
    • Issue date May 4, 1993
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20020027152
    • Publication date Mar 7, 2002
    • KABUSHIKI KAISHA SHINKAWA
    • Hiroshi Ushiki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20020023942
    • Publication date Feb 28, 2002
    • KABUSHIKI KAISHA SHINKAWA
    • Yoshimitsu Terakado
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding method and apparatus
    • Publication number 20010004991
    • Publication date Jun 28, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Tooru Mochida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20010002031
    • Publication date May 31, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Tooru Mochida
    • G05 - CONTROLLING REGULATING