Toru Hizume

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 10,779,406
- Issue date Sep 15, 2020
- Shinko Electric Industries Co., Ltd.
- Toru Hizume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method therefor
- Patent number 9,299,678
- Issue date Mar 29, 2016
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 8,017,503
- Issue date Sep 13, 2011
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-shield type semiconductor device
- Patent number 6,285,087
- Issue date Sep 4, 2001
- Shinko Electric Industries Co., Ltd.
- Noboru Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device sealed with resin, and its manufacture
- Patent number 6,150,194
- Issue date Nov 21, 2000
- Shinko Electric Industries Co., Ltd.
- Noboru Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20190261513
- Publication date Aug 22, 2019
- Shinko Electric Industries Co., Ltd.
- Toru HIZUME
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20120153509
- Publication date Jun 21, 2012
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20110104886
- Publication date May 5, 2011
- Shinko Electric Industries Co., Ltd.
- Kiyoshi OI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD...
- Publication number 20110010932
- Publication date Jan 20, 2011
- Shinko Electric Industries Co., Ltd.
- Masato TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
- Publication number 20100225001
- Publication date Sep 9, 2010
- Shinko Electric Industries Co., Ltd.
- Toru HIZUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD...
- Publication number 20090135574
- Publication date May 28, 2009
- Shinko Electric Industries Co., Ltd.
- Masato TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...
- Publication number 20080303153
- Publication date Dec 11, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS

Toru Hizume

Person

Patents Grantslast 30 patents

Wiring substrate

Semiconductor package and manufacturing method therefor

Manufacturing method of semiconductor package

Resin-shield type semiconductor device

Semiconductor device sealed with resin, and its manufacture

Patents Applicationslast 30 patents

WIRING SUBSTRATE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...

WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...