Toru Imori

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Oxidation-resistant metallic tin
- Patent number 12,129,529
- Issue date Oct 29, 2024
- JX Advanced Metals Corporation
- Takahiro Uchida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper electrode material
- Patent number 12,132,289
- Issue date Oct 29, 2024
- JX Advanced Metals Corporation
- Masahiro Takahata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Stannous oxide powder
- Patent number 11,981,581
- Issue date May 14, 2024
- JX Metals Corporation
- Koichi Takemoto
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method for manufacturing high purity tin, electrowinning apparatus...
- Patent number 11,572,632
- Issue date Feb 7, 2023
- JX Nippon Mining & Metals Corporation
- Kouichi Takemoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High purity tin and method for manufacturing same
- Patent number 11,136,680
- Issue date Oct 5, 2021
- JX Nippon Mining & Metals Corporation
- Toru Imori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High purity tin and method for producing same
- Patent number 11,118,276
- Issue date Sep 14, 2021
- JX Nippon Mining & Metals Corporation
- Toru Imori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for vacuum packing high-purity tin and vacuum-packed high pu...
- Patent number 10,781,024
- Issue date Sep 22, 2020
- JX Nippon Mining & Metals Corporation
- Toru Imori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
High purity tin and method for manufacturing same
- Patent number 10,400,342
- Issue date Sep 3, 2019
- JX Nippon Mining & Metals Corporation
- Toru Imori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Radiation detector UBM electrode structure body, radiation detector...
- Patent number 9,823,362
- Issue date Nov 21, 2017
- JX Nippon Mining & Metals Corporation
- Masaomi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating pretreatment agent, electroless plating method...
- Patent number 8,814,997
- Issue date Aug 26, 2014
- JX Nippon Mining & Metals Corporation
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate and manufacturing method therefor
- Patent number 8,736,057
- Issue date May 27, 2014
- Nippon Mining & Metals Co., Ltd.
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-coated lipid bilayer vesicles and process for producing same
- Patent number 8,697,233
- Issue date Apr 15, 2014
- Nara Institute of Science and Technology
- Jun-ichi Kikuchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution
- Patent number 8,404,035
- Issue date Mar 26, 2013
- Nippon Mining & Metals Co., Ltd.
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated article having metal thin film formed by electroless plating
- Patent number 8,394,508
- Issue date Mar 12, 2013
- Nippon Mining & Metals Co., Ltd.
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate comprising alloy film of metal element having barrier fun...
- Patent number 8,395,264
- Issue date Mar 12, 2013
- JX Nippon Mining & Metals Corporation
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
ULSI micro-interconnect member having ruthenium electroplating laye...
- Patent number 8,390,123
- Issue date Mar 5, 2013
- Nippon Mining & Metals Co., Ltd
- Junnosuke Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-purity aqueous copper sulfonate solution and method of produci...
- Patent number 8,333,834
- Issue date Dec 18, 2012
- JX Nippon Mining & Metals Corporation
- Junnosuke Sekiguchi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method for supporting metal nanoparticles and metal nanoparticles-c...
- Patent number 8,318,313
- Issue date Nov 27, 2012
- JX Nippon Mining & Metals Corporation
- Toru Imori
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Plated product having copper thin film formed thereon by electroles...
- Patent number 8,283,051
- Issue date Oct 9, 2012
- JX Nippon Mining & Metals Corporation
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate and manufacturing method therefor
- Patent number 8,247,301
- Issue date Aug 21, 2012
- Nippon Mining & Metals Co., Ltd.
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for electroless plating and metal-plated article
- Patent number 8,182,873
- Issue date May 22, 2012
- Nippon Mining & Metals Co., Ltd
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated article having metal thin film formed by electroless plating...
- Patent number 8,163,400
- Issue date Apr 24, 2012
- Nippon Mining & Metals Co., Ltd
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component formed with barrier-seed layer on base material
- Patent number 8,089,154
- Issue date Jan 3, 2012
- Nippon Mining & Metals Co., Ltd
- Junnosuke Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin substrate material, electronic component substrate material m...
- Patent number 8,043,705
- Issue date Oct 25, 2011
- Nippon Mining & Metals Co., Ltd.
- Toshifumi Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component formed with barrier-seed layer on base material
- Patent number 8,004,082
- Issue date Aug 23, 2011
- Nippon Mining & Metals Co., Ltd
- Junnosuke Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of surface treatment using imidazole compound
- Patent number 7,968,150
- Issue date Jun 28, 2011
- Nippon Mining & Metals Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal plating method and pretreatment agent
- Patent number 7,867,564
- Issue date Jan 11, 2011
- Nippon Mining & Metals Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Iron-based sintered compact and method for production thereof
- Patent number 7,727,639
- Issue date Jun 1, 2010
- Nippon Mining & Metals Co., Ltd.
- Masataka Yahagi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Pretreating agent for electroless plating, method of electroless pl...
- Patent number 7,713,340
- Issue date May 11, 2010
- Nippon Mining & Metals Co., Ltd.
- Toshifumi Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallic powder for powder metallurgy whose main component is iron...
- Patent number 7,691,172
- Issue date Apr 6, 2010
- Nippon Mining & Metals Co., Ltd.
- Toru Imori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
OXIDATION-RESISTANT METALLIC TIN
- Publication number 20210381082
- Publication date Dec 9, 2021
- JX NIPPON MINING & METALS CORPORATION
- Takahiro UCHIDA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
COPPER ELECTRODE MATERIAL
- Publication number 20210359482
- Publication date Nov 18, 2021
- JX NIPPON MINING & METALS CORPORATION
- Masahiro TAKAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANNOUS OXIDE POWDER
- Publication number 20210047198
- Publication date Feb 18, 2021
- JX NIPPON MINING & METALS CORPORATION
- Koichi TAKEMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STANNOUS OXIDE POWDER AND METHOD FOR PRODUCING SAME
- Publication number 20200231461
- Publication date Jul 23, 2020
- JX NIPPON MINING & METALS CORPORATION
- Koichi TAKEMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING HIGH PURITY TIN, ELECTROWINNING APPARATUS...
- Publication number 20200071842
- Publication date Mar 5, 2020
- JX NIPPON MINING & METALS CORPORATION
- Kouichi Takemoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH PURITY TIN AND METHOD FOR MANUFACTURING SAME
- Publication number 20190338431
- Publication date Nov 7, 2019
- JX NIPPON MINING & METALS CORPORATION
- Toru IMORI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH PURITY TIN AND METHOD FOR PRODUCING SAME
- Publication number 20190153607
- Publication date May 23, 2019
- JX Nippon Mining & Metals Corp.
- Toru IMORI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR VACUUM PACKING HIGH-PURITY TIN AND VACUUM-PACKED HIGH PU...
- Publication number 20190055077
- Publication date Feb 21, 2019
- JX NIPPON MINING & METALS CORPORATION
- Toru IMORI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
HIGH PURITY TIN AND METHOD FOR MANUFACTURING SAME
- Publication number 20180298506
- Publication date Oct 18, 2018
- JX NIPPON MINING & METALS CORPORATION
- TORU IMORI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RADIATION DETECTOR UBM ELECTRODE STRUCTURE BODY, RADIATION DETECTOR...
- Publication number 20170108594
- Publication date Apr 20, 2017
- JX NIPPON MINING & METALS CORPORATION
- Masaomi Murakami
- G01 - MEASURING TESTING
Information Patent Application
Method For Manufacturing High Purity Tin, Electrowinning Apparatus...
- Publication number 20160097139
- Publication date Apr 7, 2016
- JX NIPPON MINING & METALS CORPORATION
- Kouichi Takemoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS PLATING PRETREATMENT AGENT, ELECTROLESS PLATING METHOD...
- Publication number 20120192758
- Publication date Aug 2, 2012
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH-PURITY AQUEOUS COPPER SULFONATE SOLUTION AND METHOD OF PRODUCI...
- Publication number 20120174827
- Publication date Jul 12, 2012
- Junnosuke Sekiguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20120104502
- Publication date May 3, 2012
- JX NIPPON MINING & METALS CORPORATION
- Toru Imori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER ELECTROPLATED AND/OR SILVER ALLOY ELECTROPLATED ARTICLE HAVI...
- Publication number 20120097545
- Publication date Apr 26, 2012
- Toru Imori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate comprising alloy film of metal element having barrier fun...
- Publication number 20110241209
- Publication date Oct 6, 2011
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATED PRODUCT HAVING COPPER THIN FILM FORMED THEREON BY ELECTROLES...
- Publication number 20110129688
- Publication date Jun 2, 2011
- Junichi Ito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC COMPONENT FORMED WITH BARRIER-SEED LAYER ON BASE MATERIAL
- Publication number 20110006426
- Publication date Jan 13, 2011
- Junnosuke Sekiguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC COMPONENT FORMED WITH BARRIER-SEED LAYER ON BASE MATERIAL
- Publication number 20110006427
- Publication date Jan 13, 2011
- Junnosuke Sekiguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ULSI MICRO-INTERCONNECT MEMBER HAVING RUTHENIUM ELECTROPLATING LAYE...
- Publication number 20100314766
- Publication date Dec 16, 2010
- Junnosuke Sekiguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100244258
- Publication date Sep 30, 2010
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100244259
- Publication date Sep 30, 2010
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR SUPPORTING METAL NANOPARTICLES AND METAL NANOPARTICLES-C...
- Publication number 20100215970
- Publication date Aug 26, 2010
- Nippon Mining & Metals Co. Ltd
- Toru Imori
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Plated article having metal thin film formed by electroless plating...
- Publication number 20100038111
- Publication date Feb 18, 2010
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plated article having metal thin film formed by electroless plating...
- Publication number 20100003539
- Publication date Jan 7, 2010
- Atsushi Yabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of surface treatment using imidazole compound
- Publication number 20090068364
- Publication date Mar 12, 2009
- Nikko Materials Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal-Coated Lipid Bilayer Vesicles and Process for Producing Same
- Publication number 20090042021
- Publication date Feb 12, 2009
- Nara Institute of Science and Technology
- Jun-ichi Kikuchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming a seed layer for damascene copper wiring, and se...
- Publication number 20080224313
- Publication date Sep 18, 2008
- Atsushi Yabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Resin Substrate Material, Electronic Component Substrate Material M...
- Publication number 20080138629
- Publication date Jun 12, 2008
- Toshifumi Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Iron-Based Sintered Compact and Method for Production Thereof
- Publication number 20080138642
- Publication date Jun 12, 2008
- Nippon Mining & Metals Co., Ltd.
- Masataka Yahagi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Person

Patents Grantslast 30 patents

Oxidation-resistant metallic tin

Copper electrode material

Stannous oxide powder

Method for manufacturing high purity tin, electrowinning apparatus...

High purity tin and method for manufacturing same

High purity tin and method for producing same

Method for vacuum packing high-purity tin and vacuum-packed high pu...

High purity tin and method for manufacturing same

Radiation detector UBM electrode structure body, radiation detector...

Electroless plating pretreatment agent, electroless plating method...

Substrate and manufacturing method therefor

Metal-coated lipid bilayer vesicles and process for producing same

Electroless copper plating solution

Plated article having metal thin film formed by electroless plating

Substrate comprising alloy film of metal element having barrier fun...

ULSI micro-interconnect member having ruthenium electroplating laye...

High-purity aqueous copper sulfonate solution and method of produci...

Method for supporting metal nanoparticles and metal nanoparticles-c...

Plated product having copper thin film formed thereon by electroles...

Substrate and manufacturing method therefor

Method for electroless plating and metal-plated article

Plated article having metal thin film formed by electroless plating...

Electronic component formed with barrier-seed layer on base material

Resin substrate material, electronic component substrate material m...

Electronic component formed with barrier-seed layer on base material

Method of surface treatment using imidazole compound

Metal plating method and pretreatment agent

Iron-based sintered compact and method for production thereof

Pretreating agent for electroless plating, method of electroless pl...

Metallic powder for powder metallurgy whose main component is iron...

Patents Applicationslast 30 patents

OXIDATION-RESISTANT METALLIC TIN

COPPER ELECTRODE MATERIAL

STANNOUS OXIDE POWDER

STANNOUS OXIDE POWDER AND METHOD FOR PRODUCING SAME

METHOD FOR MANUFACTURING HIGH PURITY TIN, ELECTROWINNING APPARATUS...

HIGH PURITY TIN AND METHOD FOR MANUFACTURING SAME

HIGH PURITY TIN AND METHOD FOR PRODUCING SAME

METHOD FOR VACUUM PACKING HIGH-PURITY TIN AND VACUUM-PACKED HIGH PU...

HIGH PURITY TIN AND METHOD FOR MANUFACTURING SAME

RADIATION DETECTOR UBM ELECTRODE STRUCTURE BODY, RADIATION DETECTOR...

Method For Manufacturing High Purity Tin, Electrowinning Apparatus...

ELECTROLESS PLATING PRETREATMENT AGENT, ELECTROLESS PLATING METHOD...

HIGH-PURITY AQUEOUS COPPER SULFONATE SOLUTION AND METHOD OF PRODUCI...

METHOD OF PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

SILVER ELECTROPLATED AND/OR SILVER ALLOY ELECTROPLATED ARTICLE HAVI...

Substrate comprising alloy film of metal element having barrier fun...

PLATED PRODUCT HAVING COPPER THIN FILM FORMED THEREON BY ELECTROLES...

ELECTRONIC COMPONENT FORMED WITH BARRIER-SEED LAYER ON BASE MATERIAL

ELECTRONIC COMPONENT FORMED WITH BARRIER-SEED LAYER ON BASE MATERIAL

ULSI MICRO-INTERCONNECT MEMBER HAVING RUTHENIUM ELECTROPLATING LAYE...

SUBSTRATE AND MANUFACTURING METHOD THEREFOR

SUBSTRATE AND MANUFACTURING METHOD THEREFOR

METHOD FOR SUPPORTING METAL NANOPARTICLES AND METAL NANOPARTICLES-C...

Plated article having metal thin film formed by electroless plating...

Plated article having metal thin film formed by electroless plating...

Method of surface treatment using imidazole compound

Metal-Coated Lipid Bilayer Vesicles and Process for Producing Same

Method for forming a seed layer for damascene copper wiring, and se...

Resin Substrate Material, Electronic Component Substrate Material M...

Iron-Based Sintered Compact and Method for Production Thereof