Toru Mochida

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Higashiyamoto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method, wire bonding apparatus and wire bonding program
- Patent number 7,014,095
- Issue date Mar 21, 2006
- Kabushiki Kaisha Shinkawa
- Toru Mochida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method and apparatus
- Patent number 6,305,594
- Issue date Oct 23, 2001
- Kabushiki Kaisha Shinkawa
- Toru Mochida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method and apparatus
- Patent number 6,164,518
- Issue date Dec 26, 2000
- Kabushiki Kaisha Shinkawa
- Toru Mochida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for setting conveying data for a lead frame
- Patent number 6,141,599
- Issue date Oct 31, 2000
- Kabushiki Kaisha Shinkawa
- Toru Mochida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame conveying method and conveying apparatus
- Patent number 5,975,835
- Issue date Nov 2, 1999
- Kabushiki Kaisha Shinkawa
- Toru Mochida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raising-and-lowering data setting method for magazine elevator device
- Patent number 5,903,463
- Issue date May 11, 1999
- Kabushiki Kaisha Shinkawa
- Masayuki Seguro
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wire bonding method, wire bonding apparatus and wire bonding program
- Publication number 20040041008
- Publication date Mar 4, 2004
- KABUSHIKI KAISHA SHINKAWA
- Toru Mochida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR