Toru Nakai

Person

Ibigun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board
- Patent number 8,878,078
- Issue date Nov 4, 2014
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 8,756,803
- Issue date Jun 24, 2014
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer printed wiring board
- Patent number 8,683,685
- Issue date Apr 1, 2014
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus and method of plating
- Patent number 8,679,576
- Issue date Mar 25, 2014
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,581,104
- Issue date Nov 12, 2013
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer printed wiring board
- Patent number 8,499,446
- Issue date Aug 6, 2013
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 8,419,924
- Issue date Apr 16, 2013
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus, plating method and multilayer printed circuit board
- Patent number 8,383,956
- Issue date Feb 26, 2013
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing multila...
- Patent number 8,314,348
- Issue date Nov 20, 2012
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method thereof
- Patent number 8,198,544
- Issue date Jun 12, 2012
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus, plating method and multilayer printed circuit board
- Patent number 8,197,659
- Issue date Jun 12, 2012
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,013,256
- Issue date Sep 6, 2011
- Ibiden Co., Ltd.
- Toru Nakai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating method and multilayer printed circuit board
- Patent number 7,897,027
- Issue date Mar 1, 2011
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method thereof
- Patent number 7,804,031
- Issue date Sep 28, 2010
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus, plating method and multilayer printed circuit board
- Patent number 7,481,909
- Issue date Jan 27, 2009
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 7,449,781
- Issue date Nov 11, 2008
- Ibiden Co., Ltd.
- Toru Nakai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and production method for printed wiring board
- Patent number 7,129,158
- Issue date Oct 31, 2006
- Ibiden Co., Ltd.
- Toru Nakai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20120211370
- Publication date Aug 23, 2012
- IBIDEN CO., LTD.
- Toru NAKAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120067632
- Publication date Mar 22, 2012
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20120067628
- Publication date Mar 22, 2012
- IBIDEN CO., LTD.
- Toru NAKAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20120005888
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Toru Nakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20110300307
- Publication date Dec 8, 2011
- IBIDEN CO., LTD.
- Toru NAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILA...
- Publication number 20110296682
- Publication date Dec 8, 2011
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD
- Publication number 20110272286
- Publication date Nov 10, 2011
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110240358
- Publication date Oct 6, 2011
- IBIDEN CO., LTD.
- Toru NAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20110000708
- Publication date Jan 6, 2011
- IBIDEN CO., LTD.
- Toru NAKAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20100252308
- Publication date Oct 7, 2010
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD
- Publication number 20090218119
- Publication date Sep 3, 2009
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILA...
- Publication number 20090218125
- Publication date Sep 3, 2009
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20090107847
- Publication date Apr 30, 2009
- IBIDEN CO., LTD.
- Toru Nakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20090107711
- Publication date Apr 30, 2009
- IBIDEN CO., LTD.
- Toru Nakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20090065243
- Publication date Mar 12, 2009
- IBIDEN CO., LTD.
- Toru Nakai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING APPARATUS AND METHOD OF PLATING
- Publication number 20090029037
- Publication date Jan 29, 2009
- IBIDEN CO., LTD.
- Toru NAKAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20070273047
- Publication date Nov 29, 2007
- IBIDEN CO., LTD.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating apparatus, plating method and multilayer printed circuit board
- Publication number 20060065534
- Publication date Mar 30, 2006
- IBIDEN CO., LTD.
- Toru Nakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed wiring board and production method for printed wiring board
- Publication number 20050280130
- Publication date Dec 22, 2005
- IBIDEN CO., LTD.
- Toru Nakai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Printed wiring board

Method for manufacturing printed wiring board

Method of manufacturing multilayer printed wiring board

Plating apparatus and method of plating

Wiring board and method for manufacturing the same

Method of manufacturing multilayer printed wiring board

Wiring substrate and method for manufacturing wiring substrate

Plating apparatus, plating method and multilayer printed circuit board

Multilayer printed wiring board and method of manufacturing multila...

Printed wiring board and manufacturing method thereof

Plating apparatus, plating method and multilayer printed circuit board

Printed wiring board

Plating apparatus, plating method and multilayer printed circuit board

Printed wiring board and manufacturing method thereof

Plating apparatus, plating method and multilayer printed circuit board

Printed wiring board

Printed wiring board and production method for printed wiring board

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD

METHOD FOR MANUFACTURING WIRING BOARD

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILA...

METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILA...

PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD

PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

PLATING APPARATUS AND METHOD OF PLATING

PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

Plating apparatus, plating method and multilayer printed circuit board

Printed wiring board and production method for printed wiring board