Toru Nomura

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin-encapsulation semiconductor device and method for fabricating...
- Patent number 7,338,838
- Issue date Mar 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for the fabrication thereof includi...
- Patent number 7,309,624
- Issue date Dec 18, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for the fabrication thereof grindin...
- Patent number 7,125,751
- Issue date Oct 24, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal land frame and method for manufacturing the same
- Patent number 7,026,192
- Issue date Apr 11, 2006
- Matsushita Electric Industrial Co. Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin encapsulation semiconductor device utilizing grooved leads an...
- Patent number 6,909,168
- Issue date Jun 21, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method for manufacturin...
- Patent number 6,710,430
- Issue date Mar 23, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method for manufacturin...
- Patent number 6,692,991
- Issue date Feb 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding an identifying mark on the resin surface of an...
- Patent number 6,680,220
- Issue date Jan 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,680,524
- Issue date Jan 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with multiple rows of external terminals
- Patent number 6,674,154
- Issue date Jan 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal land frame and method for manufacturing the same
- Patent number 6,667,541
- Issue date Dec 23, 2003
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for the fabrication thereof
- Patent number 6,498,393
- Issue date Dec 24, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, method of manufacturing lead frame, semiconductor devic...
- Patent number 6,225,146
- Issue date May 1, 2001
- Matsushita Electronics Corporation
- Yukio Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, method of manufacturing lead frame, semiconductor devic...
- Patent number 5,977,615
- Issue date Nov 2, 1999
- Matsushita Electronics Corporation
- Yukio Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of manufacturing the same, and resin sealed s...
- Patent number 5,708,295
- Issue date Jan 13, 1998
- Matsushita Electronics Corporation
- Akira Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and method of manufacturing the same
- Patent number 5,336,367
- Issue date Aug 9, 1994
- Matsushita Electric Industrial Co. Ltd.
- Toru Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and method of manufacturing the same
- Patent number 5,321,249
- Issue date Jun 14, 1994
- Matsushita Electric Industrial Co., Ltd.
- Toru Nomura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20060252183
- Publication date Nov 9, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulation semiconductor device and method for fabricating...
- Publication number 20050167855
- Publication date Aug 4, 2005
- Matsushita Electric Industrial Co. Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20050133892
- Publication date Jun 23, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor device and method for manufacturin...
- Publication number 20040155361
- Publication date Aug 12, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor device and method for manufacturin...
- Publication number 20040155363
- Publication date Aug 12, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor device and method for manufacturin...
- Publication number 20030102575
- Publication date Jun 5, 2003
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20030038359
- Publication date Feb 27, 2003
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulation semiconductor device and method for fabricating...
- Publication number 20030015775
- Publication date Jan 23, 2003
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Terminal land frame and method for manufacturing the same
- Publication number 20020160552
- Publication date Oct 31, 2002
- Matsushita Electronics Corporation
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20020137254
- Publication date Sep 26, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame
- Publication number 20020121670
- Publication date Sep 5, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor device and method for manufacturin...
- Publication number 20020121650
- Publication date Sep 5, 2002
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20020052056
- Publication date May 2, 2002
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20020050631
- Publication date May 2, 2002
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20010040286
- Publication date Nov 15, 2001
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS

Toru Nomura

Person

Patents Grantslast 30 patents

Resin-encapsulation semiconductor device and method for fabricating...

Semiconductor device and method for the fabrication thereof includi...

Semiconductor device and method for the fabrication thereof grindin...

Terminal land frame and method for manufacturing the same

Resin encapsulation semiconductor device utilizing grooved leads an...

Resin-encapsulated semiconductor device and method for manufacturin...

Resin-encapsulated semiconductor device and method for manufacturin...

Method of embedding an identifying mark on the resin surface of an...

Semiconductor device and method for fabricating the same

Lead frame with multiple rows of external terminals

Terminal land frame and method for manufacturing the same

Semiconductor device and method for the fabrication thereof

Lead frame, method of manufacturing lead frame, semiconductor devic...

Lead frame, method of manufacturing lead frame, semiconductor devic...

Lead frame and method of manufacturing the same, and resin sealed s...

Solid-state imaging device and method of manufacturing the same

Solid-state imaging device and method of manufacturing the same

Patents Applicationslast 30 patents

Semiconductor device and method for the fabrication thereof

Resin-encapsulation semiconductor device and method for fabricating...

Semiconductor device and method for the fabrication thereof

Resin-encapsulated semiconductor device and method for manufacturin...

Resin-encapsulated semiconductor device and method for manufacturin...

Resin-encapsulated semiconductor device and method for manufacturin...

Semiconductor device and method for the fabrication thereof

Resin-encapsulation semiconductor device and method for fabricating...

Terminal land frame and method for manufacturing the same

Semiconductor device and method for fabricating the same

Lead frame

Resin-encapsulated semiconductor device and method for manufacturin...

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for the fabrication thereof