Toru Tachikawa

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 6,046,071
- Issue date Apr 4, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 5,834,340
- Issue date Nov 10, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package and method of manufacturing th...
- Patent number 5,710,062
- Issue date Jan 20, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded semiconductor package
- Patent number 5,554,887
- Issue date Sep 10, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Akiyoshi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC card having adhesion-preventing sheets
- Patent number 5,327,010
- Issue date Jul 5, 1994
- Ryoden Kasei Co., Ltd.
- Takeshi Uenaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having particular power distribution interconn...
- Patent number 5,309,021
- Issue date May 3, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Haruo Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC card
- Patent number 5,299,940
- Issue date Apr 5, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Takeshi Uenaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Battery terminal mounting means for a portable electrical device
- Patent number 5,299,955
- Issue date Apr 5, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Hajime Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device card having a plurality of self-locking pawls
- Patent number 5,278,445
- Issue date Jan 11, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Shunichi Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device card and method of manufacturing the same
- Patent number 5,173,841
- Issue date Dec 22, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Takeshi Uenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package having particular lead structure for m...
- Patent number 5,105,261
- Issue date Apr 14, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting electrode
- Patent number 5,024,605
- Issue date Jun 18, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Yasushi Kasatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular semiconductor device
- Patent number 5,025,307
- Issue date Jun 18, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS

Toru Tachikawa

Person

Patents Grantslast 30 patents

Plastic molded semiconductor package and method of manufacturing th...

Plastic molded semiconductor package and method of manufacturing th...

Plastic molded semiconductor package and method of manufacturing th...

Plastic molded semiconductor package

IC card having adhesion-preventing sheets

Semiconductor device having particular power distribution interconn...

IC card

Battery terminal mounting means for a portable electrical device

Semiconductor device card having a plurality of self-locking pawls

Semiconductor device card and method of manufacturing the same

Semiconductor device package having particular lead structure for m...

Connecting electrode

Modular semiconductor device