Toru Takisawa

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Atsugi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, substrate support apparatus, substr...
- Patent number 6,706,618
- Issue date Mar 16, 2004
- Canon Kabushiki Kaisha
- Toru Takisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate support apparatus, substr...
- Patent number 6,451,670
- Issue date Sep 17, 2002
- Canon Kabushiki Kaisha
- Toru Takisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method, apparatus and vacuum chuck
- Patent number 6,383,890
- Issue date May 7, 2002
- Canon Kabushiki Kaisha
- Toru Takisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method
- Patent number 6,309,505
- Issue date Oct 30, 2001
- Canon Kabushiki Kaisha
- Toru Takisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anodization apparatus with supporting device for substrate to be tr...
- Patent number 5,458,755
- Issue date Oct 17, 1995
- Canon Kabushiki Kaisha
- Yasutomo Fujiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Substrate processing apparatus, substrate support apparatus, substr...
- Publication number 20020182038
- Publication date Dec 5, 2002
- TORU TAKISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE SUPPORT APPARATUS, SUBSTR...
- Publication number 20020034859
- Publication date Mar 21, 2002
- TORU TAKISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD, APPARTUS AND VACUUM CHUCK
- Publication number 20020001920
- Publication date Jan 3, 2002
- TORU TAKISAWA
- H01 - BASIC ELECTRIC ELEMENTS