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Ebina, JP
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last 30 patents
Information
Patent Grant
Backdrilling method, and backdrilling apparatus
Patent number
9,655,251
Issue date
May 16, 2017
Via Mechanics, Ltd.
Yujiro Araki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Manufacturing method of a multi-layered circuit board
Patent number
7,488,676
Issue date
Feb 10, 2009
Hitachi Via Mechanics, Ltd.
Yasuhiko Kanaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Backdrilling Method, and Backdrilling Apparatus
Publication number
20150245494
Publication date
Aug 27, 2015
Via Mechanics, Ltd.
Yujiro ARAKI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-layered circuit board and manufacturing method of multi-layer...
Publication number
20060127652
Publication date
Jun 15, 2006
Yasuhiko Kanaya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR