Toshiak Ishii

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Hitachi-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Circuit tape having adhesive film semiconductor device and a method...
- Patent number 7,202,570
- Issue date Apr 10, 2007
- Renesas Technology Corp.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film, semiconductor device, and a meth...
- Patent number 6,791,194
- Issue date Sep 14, 2004
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film, semiconductor device, and a meth...
- Patent number 6,114,753
- Issue date Sep 5, 2000
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circuit tape having adhesive film semiconductor device and a method...
- Publication number 20040224149
- Publication date Nov 11, 2004
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit tape having adhesive film, semiconductor device, and a meth...
- Publication number 20020160185
- Publication date Oct 31, 2002
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS