Toshiaki HIBINO

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board
- Patent number 10,420,214
- Issue date Sep 17, 2019
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,451,711
- Issue date Sep 20, 2016
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 9,420,708
- Issue date Aug 16, 2016
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 8,931,168
- Issue date Jan 13, 2015
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20180279474
- Publication date Sep 27, 2018
- IBIDEN CO., LTD.
- Toshiaki HIBINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140216794
- Publication date Aug 7, 2014
- IBIDEN CO., LTD.
- Toshiaki HIBINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
- Publication number 20120246924
- Publication date Oct 4, 2012
- IBIDEN CO., LTD.
- Toshiaki HIBINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
- Publication number 20120246925
- Publication date Oct 4, 2012
- IBIDEN CO., LTD.
- Toshiaki HIBINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR