Toshiaki Morita

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a stacked electrode with an electroless...
- Patent number 10,847,614
- Issue date Nov 24, 2020
- Hitachi Power Semiconductor Device, Ltd.
- Tomoyasu Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power conversion apparatus
- Patent number 10,763,346
- Issue date Sep 1, 2020
- Hitachi Power Semiconductor Device, Ltd.
- Tomoyasu Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and power module, and manufacturing method of th...
- Patent number 10,522,638
- Issue date Dec 31, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Masakazu Sagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating structure and semiconductor module using same
- Patent number 10,177,069
- Issue date Jan 8, 2019
- Hitachi Ltd.
- Takashi Naito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,912,644
- Issue date Dec 16, 2014
- Hitachi, Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Low temperature bonding material comprising coated metal nanopartic...
- Patent number 8,821,676
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding material using metal particle
- Patent number 8,821,768
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scanning probe microscope and method of observing sample using the...
- Patent number 8,635,710
- Issue date Jan 21, 2014
- Hitachi, Ltd.
- Toshihiko Nakata
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,592,996
- Issue date Nov 26, 2013
- Hitachi, Ltd.
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding material
- Patent number 8,513,534
- Issue date Aug 20, 2013
- Hitachi, Ltd.
- Toshiaki Morita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Mosfet package
- Patent number 8,455,986
- Issue date Jun 4, 2013
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic member, electronic part and manufacturing method therefor
- Patent number 8,400,777
- Issue date Mar 19, 2013
- Hitachi, Ltd.
- Eiichi Ide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,183,607
- Issue date May 22, 2012
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scanning probe microscope and method of observing sample using the...
- Patent number 8,181,268
- Issue date May 15, 2012
- Hitachi, Ltd.
- Toshihiko Nakata
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device, manufacturing method thereof, composite metal...
- Patent number 8,008,772
- Issue date Aug 30, 2011
- Hitachi, Ltd.
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET package
- Patent number 7,985,991
- Issue date Jul 26, 2011
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature bonding material comprising metal particles and bon...
- Patent number 7,955,411
- Issue date Jun 7, 2011
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inverter and vehicle drive unit using the same
- Patent number 7,589,400
- Issue date Sep 15, 2009
- Hitachi, Ltd.
- Hiroshi Hozoji
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 7,579,805
- Issue date Aug 25, 2009
- Hitachi, Ltd.
- Atsushi Saito
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and power conversion apparatus using the same
- Patent number 7,542,317
- Issue date Jun 2, 2009
- Hitachi, Ltd.
- Katsunori Azuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, power converter device using it, and hybrid v...
- Patent number 7,528,485
- Issue date May 5, 2009
- Hitachi, Ltd.
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved adhesion between bonding and b...
- Patent number 7,449,786
- Issue date Nov 11, 2008
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET package
- Patent number 7,400,002
- Issue date Jul 15, 2008
- Renesas Technology Corp.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting an electronic part on a substrate using a liqui...
- Patent number 7,393,771
- Issue date Jul 1, 2008
- Hitachi, Ltd.
- Hiroshi Hozoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MOSFET package
- Patent number 7,394,146
- Issue date Jul 1, 2008
- Renesas Tehcnology Corp.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin encapsulated semiconductor device and the production method
- Patent number 7,372,132
- Issue date May 13, 2008
- Hitachi, Ltd.
- Kazuhiro Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MOSFET package
- Patent number 7,342,267
- Issue date Mar 11, 2008
- Renesas Technology Corp.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MOSFET package
- Patent number 7,332,757
- Issue date Feb 19, 2008
- Renesas Technology Corp.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device to provide improved...
- Patent number 7,049,214
- Issue date May 23, 2006
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Power Conversion Apparatus
- Publication number 20200075722
- Publication date Mar 5, 2020
- Hitachi Power Semiconductor Device, Ltd.
- Tomoyasu FURUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Power Conversion Apparatus
- Publication number 20200006301
- Publication date Jan 2, 2020
- Hitachi Power Semiconductor Device, Ltd.
- Tomoyasu FURUKAWA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR CHIP AND POWER MODULE, AND MANUFACTURING METHOD OF TH...
- Publication number 20190157412
- Publication date May 23, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Masakazu SAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE PARTICLES FOR BONDING, SINTERING BINDER INCLUDING SAME,...
- Publication number 20170278589
- Publication date Sep 28, 2017
- Hitachi, Ltd
- Yusuke YASUDA
- B82 - NANO-TECHNOLOGY
Information Patent Application
HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME
- Publication number 20170236768
- Publication date Aug 17, 2017
- Hitachi, Ltd
- Takashi NAITO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20160254761
- Publication date Sep 1, 2016
- Hitachi Power Semiconductor Device, Ltd.
- Tomoyasu FURUKAWA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Power Semiconductor Module
- Publication number 20150221626
- Publication date Aug 6, 2015
- Hitachi Power Semiconductor Device, Ltd.
- Shigehisa MOTOWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING ALUMINA-CRYSTAL-PARTICLE-DISPERSED ALUMINA SOL...
- Publication number 20140147661
- Publication date May 29, 2014
- Hitachi, Ltd
- Yusuke YASUDA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130299962
- Publication date Nov 14, 2013
- Hitachi, Ltd
- Eiichi IDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130264696
- Publication date Oct 10, 2013
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION
- Publication number 20130119322
- Publication date May 16, 2013
- Hitachi Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR...
- Publication number 20130105980
- Publication date May 2, 2013
- Hitachi, Ltd
- Yusuke Yasuda
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120217556
- Publication date Aug 30, 2012
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scanning Probe Microscope and Method of Observing Sample Using the...
- Publication number 20120204297
- Publication date Aug 9, 2012
- HITACHI, LTD.
- Toshihiko Nakata
- G01 - MEASURING TESTING
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20120104618
- Publication date May 3, 2012
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110298020
- Publication date Dec 8, 2011
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20110204125
- Publication date Aug 25, 2011
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156225
- Publication date Jun 30, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroshi Hozoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110012262
- Publication date Jan 20, 2011
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scanning Probe Microscope and Method of Observing Sample Using the...
- Publication number 20100325761
- Publication date Dec 23, 2010
- Hitachi, Ltd
- Toshihiko Nakata
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...
- Publication number 20100270515
- Publication date Oct 28, 2010
- Yuusuke YASUDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC MEMBER, ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR
- Publication number 20100195292
- Publication date Aug 5, 2010
- Hitachi, Ltd.
- Eiichi Ide
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device and bonding material
- Publication number 20090244868
- Publication date Oct 1, 2009
- Toshiaki Morita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Power Semiconductor Module And Method of Manufacturing the Power Se...
- Publication number 20080315401
- Publication date Dec 25, 2008
- Hitachi, Ltd
- Hisayuki Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, COMPOSITE METAL...
- Publication number 20080237851
- Publication date Oct 2, 2008
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20080173398
- Publication date Jul 24, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080169537
- Publication date Jul 17, 2008
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATIN...
- Publication number 20080160183
- Publication date Jul 3, 2008
- Eiichi Ide
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE
- Publication number 20080156398
- Publication date Jul 3, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
- Publication number 20070298244
- Publication date Dec 27, 2007
- YUSUKE YASUDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Toshiaki Morita

Person

Patents Grantslast 30 patents

Semiconductor device having a stacked electrode with an electroless...

Semiconductor device and power conversion apparatus

Semiconductor chip and power module, and manufacturing method of th...

Heat-dissipating structure and semiconductor module using same

Semiconductor device and method for manufacturing same

Electrically conductive bonding material, method of bonding with th...

Low temperature bonding material comprising coated metal nanopartic...

Bonding method and bonding material using metal particle

Scanning probe microscope and method of observing sample using the...

Semiconductor device and method of manufacturing the same

Semiconductor device and bonding material

Mosfet package

Electronic member, electronic part and manufacturing method therefor

Semiconductor device

Scanning probe microscope and method of observing sample using the...

Semiconductor device, manufacturing method thereof, composite metal...

MOSFET package

Low temperature bonding material comprising metal particles and bon...

Inverter and vehicle drive unit using the same

Semiconductor device

Semiconductor device and power conversion apparatus using the same

Semiconductor device, power converter device using it, and hybrid v...

Semiconductor device having improved adhesion between bonding and b...

MOSFET package

Method for mounting an electronic part on a substrate using a liqui...

MOSFET package

Resin encapsulated semiconductor device and the production method

MOSFET package

MOSFET package

Method of manufacturing a semiconductor device to provide improved...

Patents Applicationslast 30 patents

Semiconductor Device and Power Conversion Apparatus

Semiconductor Device and Power Conversion Apparatus

SEMICONDUCTOR CHIP AND POWER MODULE, AND MANUFACTURING METHOD OF TH...

METAL OXIDE PARTICLES FOR BONDING, SINTERING BINDER INCLUDING SAME,...

HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

Power Semiconductor Module

METHOD FOR PRODUCING ALUMINA-CRYSTAL-PARTICLE-DISPERSED ALUMINA SOL...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION

SINTERABLE BONDING MATERIAL USING COPPER NANOPARTICLES, PROCESS FOR...

SEMICONDUCTOR DEVICE

Scanning Probe Microscope and Method of Observing Sample Using the...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

SEMICONDUCTOR DEVICE

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Scanning Probe Microscope and Method of Observing Sample Using the...

ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...

ELECTRONIC MEMBER, ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR

Semiconductor device and bonding material

Power Semiconductor Module And Method of Manufacturing the Power Se...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, COMPOSITE METAL...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

SEMICONDUCTOR DEVICE

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATIN...

BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE

BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE