Toshiaki Okuno

Person

Shiga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package, chip size package device and method of manufac...
- Patent number 8,975,736
- Issue date Mar 10, 2015
- Omron Corporation
- Toshiaki Okuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical module, method of producing optical module, optical transmi...
- Patent number 8,696,216
- Issue date Apr 15, 2014
- OMRON Corporation
- Akihiko Sano
- G02 - OPTICS
Information Patent Grant
Optical transmission module, connecting part, and electronic device...
- Patent number 8,087,834
- Issue date Jan 3, 2012
- Omron Corporation
- Junichi Tanaka
- G02 - OPTICS
Information Patent Grant
Optical transmission module
- Patent number 7,907,802
- Issue date Mar 15, 2011
- OMRON Corporation
- Akihiko Sano
- G02 - OPTICS
Information Patent Grant
Optical transmission module, connecting part, and electronic device...
- Patent number 7,865,046
- Issue date Jan 4, 2011
- OMRON Corporation
- Junichi Tanaka
- G02 - OPTICS
Information Patent Grant
Optical cable module
- Patent number 7,657,140
- Issue date Feb 2, 2010
- Omron Corporation
- Toshiaki Okuno
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...
- Publication number 20140008779
- Publication date Jan 9, 2014
- Omron Corporation
- Toshiaki Okuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRODE PORTION STRUCTURE
- Publication number 20110220406
- Publication date Sep 15, 2011
- Omron Corporation
- Sayaka Doi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODE STRUCTURE AND MICRODEVICE PACKAGE PROVIDED THEREWITH
- Publication number 20110221056
- Publication date Sep 15, 2011
- Omron Corporation
- Takaaki Miyaji
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL TRANSMISSION MODULE AND ELECTRONIC DEVICE
- Publication number 20100303412
- Publication date Dec 2, 2010
- Omron Corporation
- Toshiaki Okuno
- G02 - OPTICS
Information Patent Application
LIGHT EMITTING ELEMENT CIRCUIT, LIGHT TRANSMITTING SYSTEM, LIGHT TR...
- Publication number 20100172654
- Publication date Jul 8, 2010
- Omron Corporation
- Akira Enami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSMISSION MODULE, CONNECTING PART, AND ELECTRONIC DEVICE...
- Publication number 20100054672
- Publication date Mar 4, 2010
- Omron Corporation
- Junichi Tanaka
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSMISSION MODULE
- Publication number 20090279827
- Publication date Nov 12, 2009
- Omron Corporation
- Akihiko Sano
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE, METHOD OF PRODUCING OPTICAL MODULE, OPTICAL TRANSMI...
- Publication number 20090274412
- Publication date Nov 5, 2009
- Omron Corporation
- Akihiko Sano
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSMISSION MODULE, CONNECTING PART, AND ELECTRONIC DEVICE...
- Publication number 20090175579
- Publication date Jul 9, 2009
- Omron Corporation
- Junichi Tanaka
- G02 - OPTICS
Information Patent Application
OPTICAL CABLE MODULE
- Publication number 20090110350
- Publication date Apr 30, 2009
- Omron Corporation
- Toshiaki Okuno
- G02 - OPTICS

Toshiaki Okuno

Person

Patents Grantslast 30 patents

Method for bonding wafers and structure of bonding part

Wafer level package, chip size package device and method of manufac...

Optical module, method of producing optical module, optical transmi...

Optical transmission module, connecting part, and electronic device...

Optical transmission module

Optical transmission module, connecting part, and electronic device...

Optical cable module

Patents Applicationslast 30 patents

METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART

WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...

ELECTRODE PORTION STRUCTURE

ELECTRODE STRUCTURE AND MICRODEVICE PACKAGE PROVIDED THEREWITH

OPTICAL TRANSMISSION MODULE AND ELECTRONIC DEVICE

LIGHT EMITTING ELEMENT CIRCUIT, LIGHT TRANSMITTING SYSTEM, LIGHT TR...

OPTICAL TRANSMISSION MODULE, CONNECTING PART, AND ELECTRONIC DEVICE...

OPTICAL TRANSMISSION MODULE

OPTICAL MODULE, METHOD OF PRODUCING OPTICAL MODULE, OPTICAL TRANSMI...

OPTICAL TRANSMISSION MODULE, CONNECTING PART, AND ELECTRONIC DEVICE...

OPTICAL CABLE MODULE