Toshiaki Ono

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire for bonding a semiconductor device
- Patent number 4,726,859
- Issue date Feb 23, 1988
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wire for bonding a semiconductor device
- Patent number 4,717,436
- Issue date Jan 5, 1988
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wire for bonding a semiconductor device and process for producing t...
- Patent number 4,676,827
- Issue date Jun 30, 1987
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- C30 - CRYSTAL GROWTH