Toshiaki Saka

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Itami-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for separating chips from diamond wafer
- Patent number 6,805,808
- Issue date Oct 19, 2004
- Sumitomo Electric Industries, Ltd.
- Satoshi Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for separating chips from diamond wafer
- Publication number 20030127428
- Publication date Jul 10, 2003
- Satoshi Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR