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Toshiaki Sasaki
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Tokyo, JP
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last 30 patents
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Patent Grant
Method and system for forming copper thin film
Patent number
6,726,954
Issue date
Apr 27, 2004
Anelva Corporation
Minjuan Zhang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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last 30 patents
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Patent Application
Method and system for forming copper thin film
Publication number
20020052109
Publication date
May 2, 2002
Minjuan Zhang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...