Toshiaki Shironouchi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package device, module, and electronic apparatus
- Patent number 7,812,440
- Issue date Oct 12, 2010
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,930,396
- Issue date Aug 16, 2005
- NEC Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with economical compact package and process fo...
- Patent number 6,180,435
- Issue date Jan 30, 2001
- NEC Corporation
- Hiroshi Ise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder for a semiconductor producing apparatus
- Patent number 6,086,641
- Issue date Jul 11, 2000
- NEC Corporation
- Toshiaki Shironouchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Package Device, Module, and Electronic Apparatus
- Publication number 20090065921
- Publication date Mar 12, 2009
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060097409
- Publication date May 11, 2006
- NEC Electronics Corporation
- Toshiaki Shironouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20030189259
- Publication date Oct 9, 2003
- NEC ELECTRONICS CORPORATION
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS