Toshifumi Inamasu

Person

Koshi City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, substrate processing method and bon...
- Patent number 11,804,466
- Issue date Oct 31, 2023
- Tokyo Electron Limited
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
- Patent number 11,658,146
- Issue date May 23, 2023
- Tokyo Electron Limited
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,348,791
- Issue date May 31, 2022
- Tokyo Electron Limited
- Toshifumi Inamasu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
- Patent number 11,094,667
- Issue date Aug 17, 2021
- Tokyo Electron Limited
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus
- Patent number 10,373,847
- Issue date Aug 6, 2019
- Tokyo Electron Limited
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding systems
- Patent number 10,340,248
- Issue date Jul 2, 2019
- Tokyo Electron Limited
- Masataka Matsunaga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiping pad, and nozzle maintenance apparatus and coating treatment...
- Patent number 9,468,946
- Issue date Oct 18, 2016
- Tokyo Electron Limited
- Toshifumi Inamasu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Coating method and coating unit
- Patent number 8,307,778
- Issue date Nov 13, 2012
- Tokyo Electron Limited
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage apparatus and application processing apparatus
- Patent number 7,908,995
- Issue date Mar 22, 2011
- Tokyo Electron Limited
- Toshifumi Inamasu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Floating-type substrate conveying and processing apparatus
- Patent number 7,905,195
- Issue date Mar 15, 2011
- Tokyo Electron Limited
- Tsuyoshi Yamasaki
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20230275062
- Publication date Aug 31, 2023
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220375799
- Publication date Nov 24, 2022
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220254636
- Publication date Aug 11, 2022
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
- Publication number 20210343678
- Publication date Nov 4, 2021
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE POSITIONING APPARATUS, SUBSTRATE POSITIONING METHOD, AND...
- Publication number 20210249293
- Publication date Aug 12, 2021
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20200381255
- Publication date Dec 3, 2020
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND BON...
- Publication number 20200273835
- Publication date Aug 27, 2020
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
- Publication number 20190312006
- Publication date Oct 10, 2019
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20180019140
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding System
- Publication number 20180019225
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Masataka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIPING PAD, AND NOZZLE MAINTENANCE APPARATUS AND COATING TREATMENT...
- Publication number 20140373779
- Publication date Dec 25, 2014
- Toshifumi Inamasu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
COATING METHOD AND COATING UNIT
- Publication number 20090311434
- Publication date Dec 17, 2009
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE APPARATUS AND APPLICATION PROCESSING APPARATUS
- Publication number 20090047103
- Publication date Feb 19, 2009
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Floating-type substrate conveying and processing apparatus
- Publication number 20070017442
- Publication date Jan 25, 2007
- TOKYO ELECTRON LIMITED
- Tsuyoshi Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS

Toshifumi Inamasu

Person

Patents Grantslast 30 patents

Substrate processing apparatus, substrate processing method and bon...

Bonding apparatus, bonding system, bonding method, and recording me...

Bonding apparatus and bonding method

Bonding apparatus, bonding system, bonding method, and recording me...

Bonding apparatus

Bonding systems

Wiping pad, and nozzle maintenance apparatus and coating treatment...

Coating method and coating unit

Stage apparatus and application processing apparatus

Floating-type substrate conveying and processing apparatus

Patents Applicationslast 30 patents

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

BONDING APPARATUS AND BONDING METHOD

BONDING APPARATUS AND BONDING METHOD

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...

SUBSTRATE POSITIONING APPARATUS, SUBSTRATE POSITIONING METHOD, AND...

BONDING APPARATUS AND BONDING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND BON...

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...

BONDING APPARATUS

Bonding System

WIPING PAD, AND NOZZLE MAINTENANCE APPARATUS AND COATING TREATMENT...

COATING METHOD AND COATING UNIT

STAGE APPARATUS AND APPLICATION PROCESSING APPARATUS

Floating-type substrate conveying and processing apparatus