Toshifumi Kawamura

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin substrate material, electronic component substrate material m...
- Patent number 8,043,705
- Issue date Oct 25, 2011
- Nippon Mining & Metals Co., Ltd.
- Toshifumi Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pretreating agent for electroless plating, method of electroless pl...
- Patent number 7,713,340
- Issue date May 11, 2010
- Nippon Mining & Metals Co., Ltd.
- Toshifumi Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Resin Substrate Material, Electronic Component Substrate Material M...
- Publication number 20080138629
- Publication date Jun 12, 2008
- Toshifumi Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pretreating Agent For Electroless Plating, Method Of Electroless Pl...
- Publication number 20080014362
- Publication date Jan 17, 2008
- Toshifumi Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless Plating Pretreatment Agent and Copper-Clad Laminate for...
- Publication number 20070269680
- Publication date Nov 22, 2007
- Toshifumi Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Inkjet ink composition
- Publication number 20070120880
- Publication date May 31, 2007
- Toshifumi Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR