Toshifumi Sagawa

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Hitachinaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive sheet, method for manufacturing semiconductor device using...
- Patent number 9,779,976
- Issue date Oct 3, 2017
- Hitachi Automotive Systems, Ltd.
- Satoshi Ikeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,474,191
- Issue date Oct 18, 2016
- Hitachi Automotive Systems, Ltd.
- Masato Higuma
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Adhesive Sheet, Method for Manufacturing Semiconductor Device Using...
- Publication number 20160126127
- Publication date May 5, 2016
- Hitachi Automotive Systems, Ltd.
- Satoshi IKEO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Power Semiconductor Module
- Publication number 20150016063
- Publication date Jan 15, 2015
- Hitachi Automotive Systems, Ltd.
- Masato Higuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR