Toshiharu Ishida

Person

Fujisawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pb-free solder-connected structure
- Patent number 8,907,475
- Issue date Dec 9, 2014
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 8,503,189
- Issue date Aug 6, 2013
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder foil, semiconductor device and electronic device
- Patent number 7,722,962
- Issue date May 25, 2010
- Renesas Technology Corp.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 7,709,746
- Issue date May 4, 2010
- Renesas Technology Corp.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing an electronic device having a PB free solder co...
- Patent number 7,013,564
- Issue date Mar 21, 2006
- Hitachi, Ltd.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 6,960,396
- Issue date Nov 1, 2005
- Hitachi, Ltd.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 6,774,490
- Issue date Aug 10, 2004
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Product using Zn-Al alloy solder
- Patent number 6,563,225
- Issue date May 13, 2003
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electron device and semiconductor device
- Patent number 6,555,052
- Issue date Apr 29, 2003
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus of manufacturing an electronic circuit board
- Patent number 6,204,490
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with reinforcement
- Patent number 5,440,171
- Issue date Aug 8, 1995
- Hitachi, Ltd.
- Ichiro Miyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic part mounting structure
- Patent number 5,421,081
- Issue date Jun 6, 1995
- Hitachi, Ltd.
- Suguru Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Pb-FREE SOLDER-CONNECTED STRUCTURE
- Publication number 20130286621
- Publication date Oct 31, 2013
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20100214753
- Publication date Aug 26, 2010
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20060115994
- Publication date Jun 1, 2006
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder foil semiconductor device and electronic device
- Publication number 20060061974
- Publication date Mar 23, 2006
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic apparatus
- Publication number 20040177997
- Publication date Sep 16, 2004
- Hanae Hata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and electronic device, and method of manufacturing same
- Publication number 20030184986
- Publication date Oct 2, 2003
- Hitachi, Ltd
- Tasao Soga
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electron device and semiconductor device
- Publication number 20030186072
- Publication date Oct 2, 2003
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20020163085
- Publication date Nov 7, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Product using Zn-Al alloy solder
- Publication number 20020149114
- Publication date Oct 17, 2002
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electron device and semiconductor device
- Publication number 20020066583
- Publication date Jun 6, 2002
- Tasao Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20020019077
- Publication date Feb 14, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technical field
- Publication number 20020009610
- Publication date Jan 24, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS

Toshiharu Ishida

Person

Patents Grantslast 30 patents

Pb-free solder-connected structure

Pb-free solder-connected structure and electronic device

Solder foil, semiconductor device and electronic device

Pb-free solder-connected structure and electronic device

Method of producing an electronic device having a PB free solder co...

Pb-free solder-connected structure and electronic device

Electronic device

Product using Zn-Al alloy solder

Electron device and semiconductor device

Method and apparatus of manufacturing an electronic circuit board

Semiconductor device with reinforcement

Method for producing electronic part mounting structure

Patents Applicationslast 30 patents

Pb-FREE SOLDER-CONNECTED STRUCTURE

Pb-free solder-connected structure and electronic device

Pb-free solder-connected structure and electronic device

Solder foil semiconductor device and electronic device

Electronic apparatus

Circuit board and electronic device, and method of manufacturing same

Electron device and semiconductor device

Pb-free solder-connected structure and electronic device

Product using Zn-Al alloy solder

Electron device and semiconductor device

Pb-free solder-connected structure and electronic device

Technical field